Thermomechatronics of power electronic packages

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2, Issue , 2000, Pages 270-278

  Brown, E R ^a   Shaw, M C ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK PROPAGATION; ELECTRONICS PACKAGING; FAILURE (MECHANICAL); FATIGUE OF MATERIALS; POWER ELECTRONICS; THERMAL STRESS;

CRACK GROWTH RATE; THERMOMECHANICALLY INDUCED FATIGUE CRACK; THERMOMECHATRONICS;

HEAT RESISTANCE;

EID: 0033694426     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (29)