Experimental measurement and simulation of thermal performance due to aging in power semiconductor devices

Conference Record - IAS Annual Meeting (IEEE Industry Applications Society)

Volumn 3, Issue , 2002, Pages 1746-1751

  Katsis, D C ^a   Van Wyk, J D ^a  

^a VIRGINIA STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; COMPUTER SIMULATION; ELECTRIC CURRENTS; ELECTRIC IMPEDANCE; HEAT FLUX; POWER ELECTRONICS; SEMICONDUCTING SILICON; SOLDERING; THERMAL CONDUCTIVITY;

THERMAL PERFORMANCE;

MOSFET DEVICES;

EID: 0036443069     PISSN: 01972618     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. Chung, S.Y., Valenzuela, and Baird, B. "Mechanism of Power Dissipation Capability of Power MOSFET Devices: Comparative Study Between LDMOS and VDMOS Transistors" Proceedings of 2001 International Symposium on Power Semiconductor Devices & ICs, Osaka.
2. Katsis, D.C.; van Wyk, J.D. "Void Induced Thermal Impedance In Power Semiconductor Modules: Some Transient Temperature Effects" Industry Applications Conference, 2001. Thirty-Sixth IAS Annual Meeting. Conference Record of the 2001 IEEE, Vol. 3, 2001 pp. 1905-1911.
3. th annual IEEE SEMI-THERM symposium, Proceedings 1999. San Diego, CA. pp. 22-29.
4. Ludwig, M., Goedke, A., Slattery. O., Flannery, J., O'Mathuna, S., "Characterisation of Die Attach for Power Devices using Thermal Impedance Measurement - Practice and Experiment" 2000 Intersociety Conference on Thermal Phenomena, pp. 378-384.
5. Zwikker, C. "Physical Properties of Solid Materials" Pergamon Press, London, 1954, Chapter 9.
6. "Temperature Dependent Elastic & Thermal Properties Database" http://www.jahm.com, JAHM Software, Inc. Stoneham, Massachusetts.
7. "Understanding Power MOSFETs" Intersil Corporation Application Note, October 1999, AN7244.3.