A finite element modeling of dynamic hot spot effects in MOSFET dies due to voiding in the solder die-attach

PESC Record - IEEE Annual Power Electronics Specialists Conference

Volumn 2, Issue , 2003, Pages 828-833

  Katsis, D C ^a   Van Wyk, J D ^b  

^a U S ARMY RESEARCH LABORATORY   (United States)

^b VIRGINIA POLYTECHNIC INSTITUTE AND STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRIC IMPEDANCE; FINITE ELEMENT METHOD; HEAT TRANSFER;

HOT SPOT EFFECTS;

MOSFET DEVICES;

EID: 0042658200     PISSN: 02759306     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (17)

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