Modeling and measurement of pressure-dependent junction-spreader thermal resistance for integrated circuits

American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD

Volumn 369, Issue 7, 2001, Pages 51-57

  Zhou, Peng ^a   Goodson, Kenneth E ^a  

^a Stanford University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONIC PACKAGING; HYDROSTATIC SQUEEZE FILMS; THERMAL INTERFACE MATERIALS (TIM);

ADHESIVES; DEFORMATION; INTEGRATED CIRCUITS; LUBRICATING GREASES; LUBRICATION; MATHEMATICAL MODELS; PRESSURE EFFECTS; SURFACE PROPERTIES; THERMAL CONDUCTIVITY;

HEAT RESISTANCE;

EID: 1542747926     PISSN: 02725673     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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