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Volumn , Issue , 1999, Pages 22-29
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Thermal impact of solder voids in the electronic packaging of power devices
a
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Author keywords
[No Author keywords available]
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Indexed keywords
ELECTRONICS PACKAGING;
FINITE ELEMENT METHOD;
HEAT RESISTANCE;
POWER ELECTRONICS;
SEMICONDUCTOR DEVICE MODELS;
SOLDER VOIDS;
SOLDERED JOINTS;
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EID: 0032681046
PISSN: 10652221
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Article |
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Times cited : (68)
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References (4)
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