-
1
-
-
0032267891
-
5 high-κ dielectric with rugged Si suited for mass production of high density DRAMs"
-
Dec.
-
5 high-κ dielectric with rugged Si suited for mass production of high density DRAMs," in IEDM Tech. Dig., Dec. 1998, pp. 755-758.
-
(1998)
IEDM Tech. Dig.
, pp. 755-758
-
-
Asano, I.1
Kunitomo, M.2
Yamamoto, S.3
Furukawa, R.4
Sugawara, Y.5
Uemura, T.6
Kuroda, J.7
Kanai, M.8
Nakata, M.9
Tamaru, T.10
Nakamura, Y.11
Kawagoe, T.12
Yamada, S.13
Kawakita, K.14
Kawamura, H.15
Nakamura, M.16
Morino, M.17
Kisu, T.18
Iijima, S.19
Ohji, Y.20
Sekiguchi, T.21
Tadaki, Y.22
more..
-
3
-
-
0036923792
-
"Niobia-stabilized tantalum pentoxide (NST) - Novel high-κ dielectrics for low-temperature process of MIM capacitors"
-
Dec.
-
Y. Matsui, M. Hiratani, I. Asano, and S. Kimura, "Niobia-stabilized tantalum pentoxide (NST) - Novel high-κ dielectrics for low-temperature process of MIM capacitors," in IEDM Tech. Dig., Dec. 2002, pp. 225-228.
-
(2002)
IEDM Tech. Dig.
, pp. 225-228
-
-
Matsui, Y.1
Hiratani, M.2
Asano, I.3
Kimura, S.4
-
4
-
-
0141538339
-
2/TiN capacitor technology applicable to 70 nm generation DRAMs"
-
Jun.
-
2/TiN capacitor technology applicable to 70 nm generation DRAMs," in VLSI Symp. Tech. Dig., Jun. 2003, pp. 73-74.
-
(2003)
VLSI Symp. Tech. Dig.
, pp. 73-74
-
-
Oh, S.-H.1
Chung, J.-H.2
Choi, J.-H.3
Yoo, C.-Y.4
Kim, Y.S.5
Kim, S.T.6
Chung, U.-I.7
Moon, J.T.8
-
5
-
-
84929132389
-
"An outstanding and highly manufacturable 80 nm DRAM technology"
-
Dec.
-
H. S. Kim, J. M. Park, Y. S. Hwang, M. Huh, H. K. Hwang, N. J. Kang, B. H. Lee, M. H. Cho, S. E. Kim, J. Y. Kim, B. J. Park, J. W. Lee, D. I. Kim, M. Y. Jeong, H. J. Kim, Y. J. Park, and K. Kim, "An outstanding and highly manufacturable 80 nm DRAM technology," in IEDM Tech. Dig., Dec. 2003, pp. 17.2.1-17.2.4.
-
(2003)
IEDM Tech. Dig.
-
-
Kim, H.S.1
Park, J.M.2
Hwang, Y.S.3
Huh, M.4
Hwang, H.K.5
Kang, N.J.6
Lee, B.H.7
Cho, M.H.8
Kim, S.E.9
Kim, J.Y.10
Park, B.J.11
Lee, J.W.12
Kim, D.I.13
Jeong, M.Y.14
Kim, H.J.15
Park, Y.J.16
Kim, K.17
-
6
-
-
79956040832
-
"Hexagonal polymorph of tantalum-pentoxide with enhanced dielectric constant"
-
Sep.
-
M. Hiratani, S. Kimura, T. Hamada, S. Iijima, and N. Nakanishi, "Hexagonal polymorph of tantalum-pentoxide with enhanced dielectric constant," Appl. Phys. Lett., vol. 81, no. 13, pp. 2433-2435, Sep. 2002.
-
(2002)
Appl. Phys. Lett.
, vol.81
, Issue.13
, pp. 2433-2435
-
-
Hiratani, M.1
Kimura, S.2
Hamada, T.3
Iijima, S.4
Nakanishi, N.5
-
7
-
-
0034225418
-
"Highly robust ultrathin silicon nitride films grown at low-temperature by microwave-excitation high-density plasma for giga scale integration"
-
Jul.
-
K. Sekine, Y. Saito, M. Hirayama, and T. Ohmi, "Highly robust ultrathin silicon nitride films grown at low-temperature by microwave-excitation high-density plasma for giga scale integration," IEEE Trans. Electron Devices, vol. 47, no. 7, pp. 1370-1374, Jul. 2000.
-
(2000)
IEEE Trans. Electron Devices
, vol.47
, Issue.7
, pp. 1370-1374
-
-
Sekine, K.1
Saito, Y.2
Hirayama, M.3
Ohmi, T.4
-
9
-
-
0031176515
-
"Production of a large-diameter uniform plasma by modified magnetron-typed radio frequency discharge"
-
Jul.
-
Y. Li, S. Iizuka, and N. Sato, "Production of a large-diameter uniform plasma by modified magnetron-typed radio frequency discharge" Jpn. J. Appl. Phys., vol. 36, no. 7B, pp. 4554-4557, Jul. 1997.
-
(1997)
Jpn. J. Appl. Phys.
, vol.36
, Issue.7 B
, pp. 4554-4557
-
-
Li, Y.1
Iizuka, S.2
Sato, N.3
-
10
-
-
33644489437
-
"Plasma oxidation and nitridation system for 90-to 65-nm node processes"
-
U. Ogawa, K. Shimeno, N. Sato, and R. Furukawa, "Plasma oxidation and nitridation system for 90-to 65-nm node processes," Hitachi Rev., vol. 52, no. 3, pp. 161-165, 2003.
-
(2003)
Hitachi Rev.
, vol.52
, Issue.3
, pp. 161-165
-
-
Ogawa, U.1
Shimeno, K.2
Sato, N.3
Furukawa, R.4
-
11
-
-
0021424901
-
2"
-
May
-
2," Appl. Phys. Lett., vol. 44, no. 10, pp. 969-971, May 1984.
-
(1984)
Appl. Phys. Lett.
, vol.44
, Issue.10
, pp. 969-971
-
-
Vasquez, R.P.1
Hecht, M.H.2
Grunthaner, F.J.3
Naiman, M.L.4
-
12
-
-
0027610888
-
"Evaluation of interfacial nitrogen concentration of RTP oxynitrides by reoxidation"
-
Jun.
-
Y. Okada, P. J. Tobin, V. Lakhotia, S. A. Ajuda, R. I. Hegde, J. C. Liao, P. P. Rushbrook, and J. L. J. Arias, "Evaluation of interfacial nitrogen concentration of RTP oxynitrides by reoxidation," J. Electrochem. Soc., vol. 140, no. 6, pp. L87-L89, Jun. 1993.
-
(1993)
J. Electrochem. Soc.
, vol.140
, Issue.6
-
-
Okada, Y.1
Tobin, P.J.2
Lakhotia, V.3
Ajuda, S.A.4
Hegde, R.I.5
Liao, J.C.6
Rushbrook, P.P.7
Arias, J.L.J.8
-
13
-
-
0021494624
-
"Silicon oxynitride films prepared by plasma nitridation of silicon and their application for tuunel metal-insulator-silicon diodes"
-
Sep.
-
R. Hezel, T. Meisel, and W. Streb, "Silicon oxynitride films prepared by plasma nitridation of silicon and their application for tuunel metal-insulator-silicon diodes," J. Appl. Phys., vol. 56, no. 6, pp. 1756-1761, Sep. 1984.
-
(1984)
J. Appl. Phys.
, vol.56
, Issue.6
, pp. 1756-1761
-
-
Hezel, R.1
Meisel, T.2
Streb, W.3
-
14
-
-
0033280875
-
"Leakage-current mechanism of a tantalum-pentoxide capacitor on rugged Si with CVD-TiN plate electrode for high-density DRAMs"
-
Jun.
-
H. Miki, M. Kunitomo, R. Furukawa, T. Tamaru, H. Goto, S. Iijima, Y. Ohji, H. Yamamoto, J. Kuroda, T. Kisu, and I. Asano, "Leakage-current mechanism of a tantalum-pentoxide capacitor on rugged Si with CVD-TiN plate electrode for high-density DRAMs" in VLSI Symp. Tech. Dig., Jun. 1999, pp. 99-100.
-
(1999)
VLSI Symp. Tech. Dig.
, pp. 99-100
-
-
Miki, H.1
Kunitomo, M.2
Furukawa, R.3
Tamaru, T.4
Goto, H.5
Iijima, S.6
Ohji, Y.7
Yamamoto, H.8
Kuroda, J.9
Kisu, T.10
Asano, I.11
-
15
-
-
33644494865
-
"Photoemission measurements of graded barrier in thin silicon oxynitride films"
-
Mar.
-
M. Emanuel, A. Faigon, and J. Shappir, "Photoemission measurements of graded barrier in thin silicon oxynitride films," J. Appl. Phys., vol. 57, no. 6, pp. 2285-2289, Mar. 1985.
-
(1985)
J. Appl. Phys.
, vol.57
, Issue.6
, pp. 2285-2289
-
-
Emanuel, M.1
Faigon, A.2
Shappir, J.3
-
16
-
-
0032024519
-
"Making silicon nitride film a viable gate dielectrics"
-
Mar.
-
T. P. Ma, "Making silicon nitride film a viable gate dielectrics," IEEE Trans. Electron Devices, vol. 45, no. 3, pp. 680-690, Mar. 1998.
-
(1998)
IEEE Trans. Electron Devices
, vol.45
, Issue.3
, pp. 680-690
-
-
Ma, T.P.1
-
17
-
-
0036579505
-
"Analysis of boron penetration and gate depletion using dual-gate PMOSFETs for high performance G-bit DRAM design"
-
May
-
N. Takaura, R. Nagai, H. Asakura, S. Yamada, and S. Kimura, "Analysis of boron penetration and gate depletion using dual-gate PMOSFETs for high performance G-bit DRAM design," IEICE Trans. Electron., vol. E85-C, no. 5, pp. 1138-1145, May 2002.
-
(2002)
IEICE Trans. Electron.
, vol.E85-C
, Issue.5
, pp. 1138-1145
-
-
Takaura, N.1
Nagai, R.2
Asakura, H.3
Yamada, S.4
Kimura, S.5
-
18
-
-
0025474417
-
+ polysilicon gated pMOS devices"
-
Aug.
-
+ polysilicon gated pMOS devices," IEEE Trans. Electron Devices, vol. 37, no. 8, pp. 1842-1851, Aug. 1990.
-
(1990)
IEEE Trans. Electron Devices
, vol.37
, Issue.8
, pp. 1842-1851
-
-
Pfiester, J.R.1
Baker, F.K.2
Mele, T.C.3
Tseng, H.-H.4
Tobin, P.J.5
Hayden, J.D.6
Miller, J.W.7
Gunderson, C.D.8
Parrillo, L.C.9
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