Batch sequencing for run-to-run control: Application to chemical mechanical polishing

Industrial and Engineering Chemistry Research

Volumn 44, Issue 13, 2005, Pages 4676-4686

  Chen, Yih Hang ^a   Su, An Jhih ^a   Shiu, Sheng Jyh ^a   Yu, Cheng Ching ^a   Shen, Shih Haur ^b  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

^b Applied Materials Taiwan   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CONTROL THEORY; FEEDBACK CONTROL; FREQUENCY DOMAIN ANALYSIS; PERFORMANCE; SEMICONDUCTOR DEVICE MANUFACTURE;

CHEMICAL SYSTEMS; CONTROL PERFORMANCE; MECHANICAL SYSTEMS; RUN-TO-RUN (R2R) CONTROL;

CHEMICAL MECHANICAL POLISHING;

PROCESS CONTROL;

EID: 22544485681     PISSN: 08885885     EISSN: None     Source Type: Journal    
DOI: 10.1021/ie0491544     Document Type: Article

References (25)

1. Ingolfsson, A.; Sachs, E. Stability and sensitivity of an EWMA controller. J. Qual. Technol. 1993, 25, 271-287.
2. Sachs, E.; Hu, A.; Ingolfsson, A. Run by run process control: combining SPC and feedback control. IEEE Trans. Semicond. Manuf. 1995, 8, 26-43.
3. Butler, S. W.; Stefani, J. A. Supervisory run-to-run control of polysilicon gate etch using in situ ellipsometry. IEEE Trans. Semicond. Manuf. 1994, 7, 193-201.
4. Chen, A.; Guo, R. S. Age-based double EWMA controller and its application to CMP processes. IEEE Trans. Semicond. Manuf. 2001, 14, 11-19.
5. Boning, D. S.; Moyne, W. P.; Smith, T. H.; Moyne, J.; Telfeyan, R.; Hurwitz, A.; Shellman, S.; Taylor, J. Run by run control of chemical-mechanical polishing. IEEE Trans. Compon. Packag. Manuf. Technol. Part C 1996, 19, 307-314.
6. Qin, S. J.; Scheid, G. W.; Riley, T. J. Adaptive run-to-run control and monitoring for a rapid thermal processor. J. Vac. Sci. Technol. B 2003, 21, 301-310.
7. Del Castillo, E.; Hurwitz, A. M. Run-to-run process control: literature review and extensions. J. Qual. Technol. 1997, 29, 184-196.
8. Nagrath, D.; Bequette, B. W.; Cramer, S. M. Evolutionary operation and control of Chromatographie processes. AIChE J. 2003, 49, 82-95.
9. Patel, N. S.; Miller, G. A.; Guinn, C.; Jenkins, S. T. Device dependent control of chemical-mechanical polishing of dielectric films. IEEE Trans. Semicond. Manuf. 2000, 13, 331-343.
10. Ljung, L.; Soderstrom, T. Theory and Practice of Recursive Identification; MIT Press: Cambridge, MA, 1983.
11. Moyne, J.; Del Castillo, E.; Hurwitz, A. M. Run-to-Run Control in Semiconductor Manufacturing; CRC Press: Boca Raton, FL, 2001.
12. Del Castillo, E. Statistical Process Adjustment for Quality Control; Wiley: New York, 2002.
13. Skogestad, S.; Postlethwaite, I. Multivariable Feedback Control; John Wiley & Sons: Chichester, U.K., 1996.
14. Strang, G. Linear Algebra and Its Applications, 3rd ed.; Harcourt Brace Jonovich: San Diego, CA, 1988.
15. Steward, G. W. Introduction to Matrix Computations; Academic Press: New York, 1973.
16. Edgar, T. F.; Butler, S. W.; Campbell, W. J.; Pfeiffer, C.; Bode, C.; Hwang, S. B.; Balakrishnan, K. S.; Hahn, J. Automatic control of microelectronics manufacturing: practices, challenges and possibilities. Automatica 2000, 36, 1567-1603.
17. Kaufman, F. B.; Thompson, D. B.; Broadie, R. E.; Jaso, M. A.; Guthrie, W. L.; Pearson, D. J.; Small, M. B. Chemicalmechanical polishing for fabricating patterned W metal features as chip interconnects. J. Electrochem. Soc. 1991, 138, 3460-3465.
18. Yao, C. H.; Feke, D. L.; Robinson, K. M.; Meikleb, S. The influence of feature-scale surface geometry on CMP processes. J. Electrochem. Soc. 2000, 147, 3094-3099.
19. Chen, C. Y.; Yu, C. C.; Shen, S. H.; Ho, M. Operational aspects of chemical mechanical polishing: polish pad profile optimization. J. Electrochem. Soc. 2000, 147, 3922-3930.
20. Chiu, J. B.; Yu, C. C.; Shen, S. H. Application of soft landing to the process control of chemical mechanical polishing. Microelectron. Eng. 2003, 65, 345-356.
21. Kao, Y. C.; Yu, C. C.; Shen, S. H. Robust operation of copper chemical mechanical polishing. Microelectron. Eng. 2003, 65, 61-75.
22. Prasad, S.; Loh, W.; Kapoor, A.; Chang, E.; Stein, B.; Boning, D.; Chung, J. Statistical metrology for characterizing CMP processes. Microelectron. Eng. 1997, 33, 231-240.
23. Chiu, J.B.; Su, A. J.; Yu, C. C.; Shen, S. H. Planarization strategy of Cu CMP: interaction between of plated copper thickness and removal rate. J. Electrochem. Soc. 2004, 151, G217-G222.
24. Shiu, S. J.; Yu, C. C.; Shen, S. H. Multivariable Control of Multi-Zone Chemical Mechanical Polishing. J. Vac. Sci. Technol. B 2004, 22, 1679-1687.
25. Preston, F. W. The theory and design of plate glass polishing machines. J. Soc. Glass Technol. 1927, 11, 214-256.