Thin film sputtered silicon for silicon wafer bonding applications

Vacuum

Volumn 70, Issue 2-3, 2003, Pages 131-140

  Hurley, R E ^a   Gamble, H S ^a  

^a QUEEN'S UNIVERSITY BELFAST   (United Kingdom)

Author keywords

Low temperature bonding; Silicon; Smart cut; Soi; Sputter; Thin film

Indexed keywords

ANNEALING; BONDING; POROSITY; SPUTTERING; SURFACE ROUGHNESS; THIN FILMS;

LOW TEMPERATURE BONDING;

SILICON WAFERS;

EID: 12244295502     PISSN: 0042207X     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0042-207X(02)00631-0     Document Type: Conference Paper

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