메뉴 건너뛰기





Volumn , Issue , 2000, Pages 868-873

Assessment on the effects of electroless nickel plating on the reliability of solder ball attachment to the bond pads of PBGA substrate

Author keywords

[No Author keywords available]

Indexed keywords

METALLIZING; NICKEL PLATING; RELIABILITY; SCANNING ELECTRON MICROSCOPY; SHEAR STRENGTH; SUBSTRATES; THERMAL EFFECTS;

EID: 0034482706     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (27)

References (7)
  • Reference 정보가 존재하지 않습니다.

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.