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Volumn , Issue , 2000, Pages 868-873
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Assessment on the effects of electroless nickel plating on the reliability of solder ball attachment to the bond pads of PBGA substrate
a a b a |
Author keywords
[No Author keywords available]
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Indexed keywords
METALLIZING;
NICKEL PLATING;
RELIABILITY;
SCANNING ELECTRON MICROSCOPY;
SHEAR STRENGTH;
SUBSTRATES;
THERMAL EFFECTS;
ELECTROLESS NICKEL PLATING;
PLASTIC BALL GRID ARRAY PACKAGE;
SOLDER BALL ATTACHMENT;
THERMAL AGING EFFECT;
UNDER BUMP METALLIZATION;
ELECTRONICS PACKAGING;
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EID: 0034482706
PISSN: 05695503
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (27)
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References (7)
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