Reliability of CSP/Lead free solder joints with different surface finishes and reflow profiles

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 2002, Pages 323-328

  Xie, Dongji ^a   Geiger, David ^a   Arra, Minna ^a   Shangguan, Dongkai ^a   Phan, Hoang ^a  

^a FLEXTRONICS INTERNATIONAL   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY; FLIP CHIP DEVICES; LEAD; RELIABILITY; SEMICONDUCTOR DEVICE MANUFACTURE; TEMPERATURE;

CHIP SCALE PACKAGE; ELECTRONIC NICKEL IMMERSION GOLD; LEAD FREE SOLDER JOINTS; ORGANIC SOLDERABILITY PRESERVATIVE; REFLOW PROCESS;

SURFACE MOUNT TECHNOLOGY;

EID: 0036396938     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. Minna Arra, Dave Geiger, Dongkai Shangguan, Sammy Yi and et al, SMTA 2001, Chicago, USA.
2. Sammy Shina, Hemant Belbase, Karen Walters and et al, APEX 2001, San Diego, USA, pp. LF1-1.
3. IPC-9701, Jan. 2002.
4. IPC-SM-785, Nov. 1992.
5. Dongji Xie, Minna Arra, Dave Geiger, Hoang Phan, Dongkai Shangguan and Sammy Yi, Proceedings of IMAPS/SMTA Conference and Exhibition on Telecom Hardware Solutions, May 2002, TX, USA, pp. 83-88.
6. Ahmer Syed, Reliability of Lead-Free Solder Connections for Area-Array Packages, APEX'2001, San Diego, CA USA, pp. LF2-7.