-
1
-
-
1942422872
-
PolyMUMPs design handbook revision 8.0
-
Research Triangle Park, N.C., USA
-
D. Koester, A. Cowen, R. Mahadevan, and B. Hardy, "PolyMUMPs Design Handbook Revision 8.0", MEMSCAP, MEMS Business Unit (CRONOS), Research Triangle Park, N.C., USA, 2001.
-
(2001)
MEMSCAP, MEMS Business Unit (CRONOS)
-
-
Koester, D.1
Cowen, A.2
Mahadevan, R.3
Hardy, B.4
-
2
-
-
1942436713
-
Microassembly of 3D microstructures using a compliant, passive microgripper
-
Apr.
-
N. Dechev, W. L. Cleghorn, and James K. Mills, "Microassembly of 3D Microstructures Using a Compliant, Passive Microgripper", Journal of Microelectromechanical Systems, vol. 13, no. 2, Apr. 2004, pp. 176-189.
-
(2004)
Journal of Microelectromechanical Systems
, vol.13
, Issue.2
, pp. 176-189
-
-
Dechev, N.1
Cleghorn, W.L.2
Mills, J.K.3
-
3
-
-
0033100269
-
Batch transfer of microstructures using flip-chip solder bonding
-
Mar.
-
G A. Singh, D. Horsely, M. Cohn, A. Pisano, and R. Howe, "Batch Transfer of Microstructures Using Flip-Chip Solder Bonding", Journal of Microelectromechanical Systems, vol. 8, no. 1,Mar. 1999, pp. 27-33.
-
(1999)
Journal of Microelectromechanical Systems
, vol.8
, Issue.1
, pp. 27-33
-
-
Singh, G.A.1
Horsely, D.2
Cohn, M.3
Pisano, A.4
Howe, R.5
-
4
-
-
84886012345
-
Batch transfer assembly of micro-components onto surface and SOI MEMS
-
Sendai, Japan, June 7-10
-
M. M. Maharbiz, R.T. Howe, and K. S. J. Pister, "Batch Transfer Assembly of Micro-Components Onto Surface and SOI MEMS," Transducers '99 Conference, Sendai, Japan, June 7-10, 1999.
-
(1999)
Transducers '99 Conference
-
-
Maharbiz, M.M.1
Howe, R.T.2
Pister, K.S.J.3
-
5
-
-
0033318714
-
3D micromachined devices based on polyimide joint technology
-
Gold Coast, Queensland, Australia, SPIE vol. 3892, Oct.
-
T. Ebefors, J. Ulfstedt-Mattsson, E. Kälvesten, and G. Stemme, "3D micromachined devices based on Polyimide Joint technology", presented at SPIE Symposium on Microelectronics and MEMS, Gold Coast, Queensland, Australia, SPIE vol. 3892, Oct. 1999, pp. 118-132.
-
(1999)
SPIE Symposium on Microelectronics and MEMS
, pp. 118-132
-
-
Ebefors, T.1
Ulfstedt-Mattsson, J.2
Kälvesten, E.3
Stemme, G.4
-
6
-
-
0033331170
-
Solder self-assembly for three-dimensional microelectromechanical systems
-
K. F. Harsh, V. M. Bright, and Y. C. Lee, "Solder Self-Assembly for Three-Dimensional Microelectromechanical Systems", Sensors and Actuators A, vol. 77, 1999, pp. 237-244.
-
(1999)
Sensors and Actuators A
, vol.77
, pp. 237-244
-
-
Harsh, K.F.1
Bright, V.M.2
Lee, Y.C.3
-
7
-
-
0035369655
-
Plastic Deformation Magnetic Assembly (PDMA) of out-of-plane microstructures: Technology and application
-
June
-
J. Zou, J. Chen, C. Liu, and J. E. Schutt-Ainé, "Plastic Deformation Magnetic Assembly (PDMA) of Out-of-Plane Microstructures: Technology and Application", Journal of Microelectromechanical Systems, vol. 10, no. 2, June 2001, pp. 302-309.
-
(2001)
Journal of Microelectromechanical Systems
, vol.10
, Issue.2
, pp. 302-309
-
-
Zou, J.1
Chen, J.2
Liu, C.3
Schutt-Ainé, J.E.4
-
8
-
-
0034873704
-
A flexible experimental workcell for efficient and reliable wafer-level 3D microassembly
-
Seoul, South Korea
-
G. Yang, J.A. Gaines, and B.J. Nelson, "A flexible experimental workcell for efficient and reliable wafer-level 3D microassembly," froc. IEEE International Conference on Robotics and Automation (ICRA 2001), Seoul, South Korea, 2001, pp. 133-138.
-
(2001)
Froc. IEEE International Conference on Robotics and Automation (ICRA 2001)
, pp. 133-138
-
-
Yang, G.1
Gaines, J.A.2
Nelson, B.J.3
-
9
-
-
1942488177
-
Design, optimization and experiments of compliant microgripper
-
Washington, D.C., Nov. 15-21
-
Y. S. Oh, W. H. Lee, H. E. Stephanou, and G. D. Skidmore, "Design, Optimization and Experiments of Compliant Microgripper", Proc. ASME International Mechanical Engineering Congress and R&D Expo (IMECE2003), Washington, D.C., Nov. 15-21, 2003.
-
(2003)
Proc. ASME International Mechanical Engineering Congress and R&D Expo (IMECE2003)
-
-
Oh, Y.S.1
Lee, W.H.2
Stephanou, H.E.3
Skidmore, G.D.4
-
10
-
-
77953746978
-
Prototyping milliRobots using dextrous microassembly and folding
-
Orlando, Florida, Nov. 5-10
-
E. Shimada, J. A. Thompson, J. Yan, R. Wood, and R. S. Fearing, "Prototyping MilliRobots Using Dextrous Microassembly and Folding", Proc. ASME International Mechanical Engineering Congress and Expo (IMECE / DSCD), Orlando, Florida, Nov. 5-10, 2000.
-
(2000)
Proc. ASME International Mechanical Engineering Congress and Expo (IMECE / DSCD)
-
-
Shimada, E.1
Thompson, J.A.2
Yan, J.3
Wood, R.4
Fearing, R.S.5
-
11
-
-
0013020607
-
Design, fabrication, and characterization of SCS latching snap fasteners for micro assembly
-
San Francisco, California, Nov.
-
R. Prasad, K.-F. Böhringer, and N. C. MacDonald, "Design, Fabrication, and Characterization of SCS Latching Snap Fasteners for Micro Assembly," Proceedings of ASME International Mechanical Engineering Congress and Exposition(IMECE), San Francisco, California, Nov. 1995.
-
(1995)
Proceedings of ASME International Mechanical Engineering Congress and Exposition(IMECE)
-
-
Prasad, R.1
Böhringer, K.-F.2
MacDonald, N.C.3
-
12
-
-
0038548018
-
Corner-cube retroreflectors based on structure-assisted assembly for free-space optical communication
-
June
-
L. Zhou, J. M. Kahn, and K. S. J. Pister, "Corner-Cube Retroreflectors Based on Structure-Assisted Assembly for Free-Space Optical Communication", J. of Microelectromechanical Systems, vol. 12, no. 3, June 2003, pp. 233-242.
-
(2003)
J. of Microelectromechanical Systems
, vol.12
, Issue.3
, pp. 233-242
-
-
Zhou, L.1
Kahn, J.M.2
Pister, K.S.J.3
-
13
-
-
0032302212
-
Microassembly Technologies for MEMS
-
Santa Clara, CA, Sept.
-
M. Cohn, K.F. Böhringer, J. M. Noworolski, A. Singh, C.G Keller, K.Y. Goldberg, and R.T. Howe, "Microassembly Technologies for MEMS", SPIE Micromachining and Microfabrication, Invited Paper Plenary Session, Santa Clara, CA, Sept. 1998.
-
(1998)
SPIE Micromachining and Microfabrication, Invited Paper Plenary Session
-
-
Cohn, M.1
Böhringer, K.F.2
Noworolski, J.M.3
Singh, A.4
Keller, C.G.5
Goldberg, K.Y.6
Howe, R.T.7
-
14
-
-
2142823920
-
Tether and joint design for micro-components used in microassembly of 3D microstructures
-
San Jose, CA, Jan. 25-29
-
N. Dechev, W. L. Cleghom, and J. K. Mills, "Tether and Joint Design for Micro-Components used in Microassembly of 3D Microstructures," Proc. of SPIE Micromachining and Micro-fabrication, Photonics West, San Jose, CA, Jan. 25-29, 2004.
-
(2004)
Proc. of SPIE Micromachining and Micro-fabrication, Photonics West
-
-
Dechev, N.1
Cleghom, W.L.2
Mills, J.K.3
-
15
-
-
1942424169
-
Construction of a 3D MEMS microcoil using sequential robotic microassembly operations
-
Washington, D.C, Nov. 15-21
-
N. Dechev, W. L. Cleghorn, and J. K. Mills, "Construction of a 3D MEMS Microcoil Using Sequential Robotic Microassembly Operations," Proceedings ASME International Mechanical Engineering Congress and R&D Expo 2003, Washington, D.C, Nov. 15-21, 2003.
-
(2003)
Proceedings ASME International Mechanical Engineering Congress and R&D Expo 2003
-
-
Dechev, N.1
Cleghorn, W.L.2
Mills, J.K.3
-
16
-
-
33947151411
-
-
[online], [cited Aug. 30, 2004]
-
N. Dechev, "Microassembly Movie Files", [online], [cited Aug. 30, 2004], Available from World Wide Web: 〈http://www.mie.utoronto.ca/staff/projects/cleghorn/Microassembly/ ASME04movies.html7rang;.
-
Microassembly Movie Files
-
-
Dechev, N.1
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