Development of All Metal Electro-Thermal Actuator and its Applications

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5344, Issue , 2004, Pages 201-210

  Luo, J K ^a   He, J H ^a   Flewitt, A J ^a   Moore, D F ^a   Spearing, S M ^b   Fleck, N A ^a   Milne, W I ^a  

^a UNIVERSITY OF CAMBRIDGE   (United Kingdom)

^b MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Electroplating; Finite element analysis; Heatuator; Metal thermal actuator; Microswitch; Ni

Indexed keywords

CURRENT DENSITY; ELECTRIC SWITCHES; ELECTROPLATING; FINITE ELEMENT METHOD; HEAT TRANSFER; MATHEMATICAL MODELS; MICROELECTROMECHANICAL DEVICES; OPTIMIZATION; SCANNING ELECTRON MICROSCOPY; SENSORS; THERMAL CONDUCTIVITY;

HEATUATORS; METAL THERMAL ACTUATORS; MICROSWITCHES; POWER CONSUMPTION;

ACTUATORS;

EID: 2142715612     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.524098     Document Type: Conference Paper

References (31)

1. W.D.Cowan and V.M.Bright, "Vertical thermal actuator for micro-opto-electro-mechanical system", Proc. SPIE, 3226, 137-146 (1997).
2. J.R.Reid, V.M.Bright and J.H.Comtois, "Force measurements of polysilicon thermal micro-actuators", Proc. SPIE, 2882, 296-306 (1996).
3. T.Moulton and G.K.Ananthasuresh, "Micromechanical devices with embedded electro-thermal-compliant actuation", Sensors & Actuators A, 90, 38-48 (2001).
4. E.S.Kolesar, P.B.Allen, J.T.Howard, J.M.Wilken and N.C.Boydston, "Thermally actuated microbeam for large in-plane mechanical deflections", J. Vac. Sci. Technol. A, 17, 2257-63 (1999).
5. Q.A.Huang and N.K.S.Lee, "Analysis and design of polysilicon thermal flexure actuator", J. Micromech. MicroEng. 9, 64-70 (1999).
6. R. Hickey, M.Kujath and T.Hubbard, "Heat transfer analysis and optimization of two-beam microelectromechanical thermal actuators", J. Vac. Sci. Technol. A 20, 971-974 (2002).
7. D.Koester, R.Mahedevan and K.Marcus, "Multi-User MEMS Processes (MUMP) Introduction and Design Rules" rev.3, Oct. 1994, MCNC MEMS Technology Applications Centre, 3021 Cornwallis Road, Research Triangle Park, NC 27709.
8. S.D.Leith and D.T.Schwartz; "High rate through-mold electrodeposition of thick (>200um) NiFe MEMS components with uniform composition", J. Microelectromech. Sys. 8, 384-392 (1999).
9. J.Gobet, F.Cardot, J.Bergqvist and F.Rudolf, "Electrodeposition of 3D microstructures on Silicon", J Micromech. Micoreng. 3, 123-130 (1993).
10. W.H.The, J.K.Luo, M.A.Graham, A.Pavlov, C.G.Smith, "Near-zero curvature fabrication of miniaturized micromechanical Ni switches using electron beam cross-linked PMMA", J Micromech. Micoreng. 13, 591-598 (2003).
11. S.Majumder, N.E.McGruer and P.Zavracky, "Electrostatically actuated micromechanical switches", J. Vac. Sci. Tech. A 15, 1246 (1997).
12. K.Kataoka, S.Kawamura, T.Itoh.K.Ishikawa, H.Honma and T.Suga, "Electroplating Ni micro-cantilevers for low contact-force IC probing", Sensors and Actuators A, 103, 116-121 (2003).
13. th Annual Int. Relay conf. NARM April '98, Oak Brook, Illinois, 1231-1234, (1998).
14. S. Kawahito, Y.Sasaki, M.Ishida and T.Nakamura, Digest Tech. Papers, Transducers 93, 888 (1993).
15. T.Hirano, T.Furuhata and H. Fujita, Digest Tech. Papers, Transducers 93, 80 (1993).
16. W.N.Jr.Sharpe, "Mechanical Properties of MEMS Materials" 2001, Johns Hopkins University: Baltimore, MD USA.
17. M.F.Ashby, "Materials Selection in Mechanical Design" 2nd edited. 1999, Boston: Butterworth Heinemann
18. J.W.Gardner, "Microsensors: Principles and Applications" 1994: John Wiley & Son.
19. R.V.Shenoy and M.Datta, "Effect of mask wall angle on shape evolution during through-mask electrochemical micromachining", J. Electrochem. Soc. 143, 544-549 (1996).
20. Marc J. Madou, "Fundamentals of Microfabrication" Chapt.5. CRC PRESS, London/New York.
21. Stephen.D.Senturia, "Microsystem Design" Chapt.9. Kluwer Academic Publisher, Boston/London.
22. S.A.Watson, "Compendium on nickel electroplating and electroforming", Ni Development Institute Tech. Series Reports 10047-10055.
23. J.C.Sadak and F.K.Sautter, "Composition, mechanical properties and structure of electrodeposited cobalt-iron alloy", J. Vac. Sci. Tech. 11, 771-776 (1974).
24. J.K.Luo, A.J.Flewitt, S.M.Spearing, N.A.Fleck and W.I.Milne, "Effects of plating process on the properties of electroplated Ni thin film" To be Submitted to IEEE J. Microelectromechanical Systems.
25. Alfa Aesar, Research Chemicals Metals and Materials, 2003 Catalogue, p.945.
26. 24 metallic glass alloy", J. Phys. Condens. Matter 4, 9501-9508 (1992).
27. S.C.Chang, J.M.Shieh, K.C.Lin, B.T.Dai, T.C.Wang, C.F.Chen, M.S.Feng, Y.H.Li and C.P.Lu, "Investigation of effects of bias polarization and chemical parameters on morphology and filling capability of 130nm damascene", J. Vac. Sci. Technol. B19, 767-773 (2001).
28. P.Boyle, D.F.Moore and R.R.A.Syms, "Micropackaging using thin films as mechanical components", IEEE Electro. Component & Technol. Conf. 2002,
29. Y.C.Tai and R.S.Muller, "Measurement of Young's modulus on microfabricated structures using a surface profiler", IEEE J. Microelectromechanical Systems, pp,147-152 (1990).
30. D.Yan, A.Khajepour and R.Mansour, "Modelling of two-hot-arm horizontal thermal actuator", J Micromech. Micoreng. 13, 312-322 (2003).
31. P.Lerch, C.K.Slimane, B.Romanowicz and P.Renaud, "Modelization and characterization of asymmetrical thermal micro-actuators", J Micromech. Micoreng. 6, 134-137 (1996).