Micropackaging using thin films as mechanical components

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 801-807

  Boyle, P ^a   Moore, D F ^a   Syms, R R A ^b  

^a UNIVERSITY OF CAMBRIDGE   (United Kingdom)

^b IMPERIAL COLLEGE LONDON   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING (DEFORMATION); COMPOSITE MICROMECHANICS; COMPUTER SIMULATION; DEFLECTION (STRUCTURES); ELASTIC MODULI; ETCHING; NUMERICAL METHODS; SILICON CARBIDE; THIN FILMS;

MICROPACKAGING;

ELECTRONICS PACKAGING;

EID: 0036290938     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: 10.1109/ECTC.2002.1008191     Document Type: Article

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