Comparative analysis of serial vs parallel links in NOC

2004 International Symposium on System-on-Chip Proceedings

Volumn , Issue , 2004, Pages 185-188

  Morgenshtein, Arkadiy ^a   Cidon, Israel ^a   Kolodny, Avinoam ^a   Ginosar, Ran ^a  

^a TECHNION ISRAEL INSTITUTE OF TECHNOLOGY   (Israel)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITANCE; COMPUTER SIMULATION; DATA TRANSFER; ELECTRIC LOADS; ENERGY DISSIPATION; INTERCONNECTION NETWORKS; LEAKAGE CURRENTS; NETWORK PROTOCOLS; PARALLEL PROCESSING SYSTEMS; SIGNAL INTERFERENCE; TELECOMMUNICATION LINKS;

ON-CHIP INTERCONNECTS; PARALLEL LINKS; SCALING FACTORS; SERIAL LINKS;

PACKET NETWORKS;

EID: 21244484285     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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