Characterization of flip-chip interconnects up to millimeter-wave frequencies based on a nondestructive in situ approach

IEEE Transactions on Advanced Packaging

Volumn 28, Issue 2, 2005, Pages 160-167

  Pfeiffer, Ullrich R ^a   Chandrasekhar, Arun ^b  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b INTEL TECHNOLOGY INDIA PVT LTD   (India)

Author keywords

Flip chip; In situ characterization; Millimeter wave (MMW) measurements; Nondestructive; Package modeling; Packaging characterization; Untermination method

Indexed keywords

FLIP CHIP DEVICES; MILLIMETER WAVES; NATURAL FREQUENCIES; NONDESTRUCTIVE EXAMINATION; SCATTERING PARAMETERS; SEMICONDUCTING SILICON; WAVEGUIDES;

IN SITU CHARACTERIZATION; MILLIMETERWAVE MEASUREMENTS; PACKAGE MODELING; PACKAGING CHARACTERIZATION; UNTERMINATION METHOD;

CHIP SCALE PACKAGES;

EID: 20344402795     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2005.846947     Document Type: Article

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