A Flip-Chip MMIC design with coplanar waveguide transmission line in the W-bnd

IEEE Transactions on Microwave Theory and Techniques

Volumn 46, Issue 12 PART 2, 1998, Pages 2276-2282

  Hirose, Tatsuya ^a   Makiyama, Kozo ^a   Ono, Katsuji ^a   Shimura, Tadayuki Miyata ^a   Aoki, Shigenori ^a   Ohashi, Yoji ^a   Yokokawa, Sigeru ^a   Watanabe, Yuu ^a  

^a FUJITSU LABORATORIES LTD   (Japan)

Author keywords

Amplifier; CPW; Flip chip; HEMT; W band

Indexed keywords

COMPUTATIONAL METHODS; ELECTRIC LINES; FLIP CHIP DEVICES; HIGH ELECTRON MOBILITY TRANSISTORS; INTEGRATED CIRCUIT LAYOUT; MATHEMATICAL MODELS; MILLIMETER WAVES; POWER AMPLIFIERS; SEMICONDUCTING INDIUM COMPOUNDS; WAVEGUIDES;

FLIP CHIP BONDING (FCB);

MONOLITHIC MICROWAVE INTEGRATED CIRCUITS;

EID: 0032302199     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/22.739211     Document Type: Article

References (14)

1. M. Berg, J. Dickmann, R. Guehl, and W. Bischof, "60-77 GHz monolithic amplifiers utilizing InP-based HEMT's and coplanar waveguides," Microwave Optical Technol. Lett., vol. 11, no. 3, pp. 139-145, Feb. 1996
2. W. H. Haydl, L. Verweyen, T. Jakobus, M. Newumann, A. Tessmann, T. Krems, M. Schlechtweg, W. Rinert, H. Massler, J. Rudiger, W. Bronner, A. Hulsmann, and T. Fink, "Compact monolithic coplanar 94 GHz front ends," in IEEE MTTS Dig., 1997, pp. 1281-1284
3. J.-E. Muller, T. Grave, H. J. Siweris, M. Kärner, A. Schäfer, H. Tischer, H. Riechert, L. Schleicher, L. Verweyen, A. Bangert, W. Kellner, and T. Meier, "A GaAs HEMT MMIC chip set for automotive radar systems fabricated by optical stepper lithography," IEEE J. Solid-State Circuits, vol. 32, pp. 1342-1348, Sept. 1997
4. M. E. Russell, A. Grain, A. Curran, R. A. Campbell, C. A. Drubin, and W. F. Miccioli, "Millimeter-wave radar sensor for automotive intelligent cruise control (ICC)," IEEE Trans. Microwave Theory Tech., vol. 45, pp. 2444-2453, Dec. 1997
5. K. Kamozaki, N. Kurita, W. Hioe, T. Tanimoto, H. Ohta, T. Nakamura, and H. Kondoh, "A 77 GHz T/R MMIC chip set for automotive radar systems," in 19th Anna. IEEE GaAs 1C Symp. Dig., Anaheim, CA, Oct. 1997, pp. 275-278
6. G. Baumann, D. Ferling, and H. Richter, "Comparison of flip chip and wire bond interconnections and the technology evaluation on 51 GHz transceiver modules," in 26th Eur. Microwave Conf. Proc., 1996, pp. 98-100.
7. H. Sakai, Y. Ota, K. Inoue, T. Yoshida, K. Takahashi, S. Fujita, and M. Sagawa, "A novel millimeter-wave 1C on Si substrate using flip-chip bonding technology," in IEEE MTTS Dig., 1994, pp. 1763-1766.
8. S. Aoki, H. Someta, S. Yokokawa, K. Ono, T. Hirose, and Y. Ohashi, "A flip chip bonding technology using gold pillars for millimeter-wave applications," in IEEE MTTS Dig., 1997, pp. 731-734.
9. T. Krems, W. Haydl, H. Massler, and J. Rudiger, "Millimeter-wave performance of chip interconnections using wire bonding and flip chip," in IEEE MTTS Dig., 1996, pp. 247-250
10. T. Krems, W. Haydl, H. Massler, and J. Rudiger, "Advantages of flip chip technology in millimeter-wave packaging," in IEEE MTTS Dig., 1997, pp. 987-990
11. M. B. Bazdar, A. R. Djordjevic, R. F. Harrington, and T. K. Sarkar, "Evaluation of quasistatic matrix parameters for multiconductor transmission lines using Galerkin's method," IEEE Trans. Microwave Theory Tech., vol. 42, pp. 1223-1228, July 1994
12. G. D. Vendelin, A. M. Pavio, and U. L. Rohde, Microwave Circuit Design Using Linear and Nonlinear Techniques. New York: Wiley, 1990
13. R. Sturdivant, "Reducing the effects of the mounting substrate on the performance of GaAs MMIC flip chips," in IEEE MTTS Dig., 1995, pp. 1591-1594
14. Y. Arai, M. Sato, H. T. Yamada, T. Hamada, K. Nagai, and H. I. Fujishiro, "60 GHz flip-chip assembled MIC design considering chipsubstrate effect," in IEEE MTTS Dig., 1997, pp. 447-150.