A new in-situ approach to flip-chip interconnect characterization up to millimeter wave FRequencies

Proceedings - 8th IEEE Workshop on Signal Propagation on Interconnects

Volumn , Issue , 2004, Pages 59-62

  Pfeiffer, Ullrich R ^a   Chandrasekhar, Arun ^b   Zwick, Thomas ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

DATA REDUCTION; MATHEMATICAL MODELS; MICROPROCESSOR CHIPS; MICROWAVES; MILLIMETER WAVE DEVICES; NATURAL FREQUENCIES; NONDESTRUCTIVE EXAMINATION;

CHIP-PACKAGE; INTERCONNECTS; THERMAL RELIABILITY; WAVE FREQUENCIES;

FLIP CHIP DEVICES;

EID: 10044242653     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

1. A. Jentzsch and W. Heinrich, "Theory and measurements of flip-chip interconnects for frequencies up to 100 GHz," IEEE Transactions on Microwave Theory and Techniques, vol. 49, no. 5, pp. 871-878, May 2001.
2. W. Heinrich, A. Jentzsch, and G. Baumann, "Millimeter-wave characteristics of flip-chip interconnects for multichip modules," IEEE Transactions on Microwave Theory and Techniques, vol. 46, no. 12, pp. 2264-2268, Dec. 1998.
3. F. Zhiping, Z. Wemge, S. Bingzhi, K.C. Gupta, and Y.C. Lee, "RF and mechanical characterization of flip-chip interconnects in CPW circuits with underfill," IEEE Transactions on Microwave Theory and Techniques, vol. 46, no. 12, pp. 2269-2275, Dec. 1998.
4. T. Hirose, K. Makiyama, K. Ono, T.M. Shimura, S. Aoki, Y. Ohashi, S. Yokokawa, and Y. Watanabe, "A flip-chip MMIC design with coplanar waveguide transmission line in the W-band," IEEE Transactions on Microwave Theory and Techniques, vol. 46, no. 12, pp. 2276-2282, Dec. 1998.
5. T. Tokumitsu, "An over-110-GHz InP HEMT flip-chip distributed baseband amplifier with inverted microstrip line structure for optical transmission system," IEEE Journal of Solid-State Circuits, vol. 38, no. 9, pp. 1479-1484, Sept. 2003.
6. S. Reynolds, B. Floyd, U. Pfeiffer, and T. Zwick, "A 60 GHz direct-conversion transceiver circuits in SiGe bipolar technology," IEEE International Solid-State Circuits Conference, Feb. 2004.
7. U. Pfeiffer and C. Schuster, "Non-destructive S-parameter measurement of a hermetically encapsulated package with comparison to high-frequency simulation," in Proceedings of the 11th IEEE Topical Meeting on Electrical Performance of Electronic Packaging, Oct. 2002, pp. 323-326.
8. U. Pfeiffer and A. Chandrasekhar, "Statistical analysis and modelling of low-cost leadless packages for wireless applications based on non-destructive measurements," in Proceedings of the 12th IEEE Topical Meeting on Electrical Perfonnance of Electronic Packaging, Oct. 2003, pp. 79-82.
9. H. Lu and T. Chu, "Port reduction method for scattering matrix measurement of an n-port network," IEEE Transactions on Microwave Theory and Techniques, vol. 48, no. 6, pp. 959-968, June 2000.