Non-destructive S-parameter measurement of a hermetically encapsulated package with comparison to high-frequency simulation

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn 2002-January, Issue , 2002, Pages 323-326

  Pfeiffer, Ullrich ^a   Schuster, Christian ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; PACKAGING; PARAMETER ESTIMATION;

HIGH FREQUENCY SIMULATION; MEASURED RESULTS; NON DESTRUCTIVE; NOVEL METHODOLOGY; ON CHIPS; PORT REDUCTION METHOD; QFN PACKAGE; S-PARAMETER MEASUREMENTS;

SCATTERING PARAMETERS;

EID: 0038074801     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEP.2002.1057942     Document Type: Conference Paper

References (6)

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