Highlights from the European thermal project PROFIT

American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP

Volumn 3, Issue , 2003, Pages 559-564

  Lasance, Clemens J M ^a  

^a PHILIPS RESEARCH LABORATORIES   (Netherlands)

Author keywords

Compact modeling; Dynamic measurements; Reliability; Test dies; Thermal characterization

Indexed keywords

COMPUTER SIMULATION; COMPUTER SOFTWARE; DATA REDUCTION; HEAT RESISTANCE; PRODUCT DEVELOPMENT; PROJECT MANAGEMENT; RESEARCH LABORATORIES; SOCIETIES AND INSTITUTIONS;

STEADY STATE ANALYSIS; THERMAL MANAGEMENT;

ENERGY MANAGEMENT;

EID: 1942504407     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2003-42173     Document Type: Conference Paper

References (24)

1. th THERMINIC Workshop, Aix-en-Provence
2. Lasance C., 2003, "Recent Progress in thermal compact modelling", Proc. SEMITHERM XIX, March, San Jose, pp. 290-299
3. Lasance C., 2001,"Two benchmarks to Facilitate the Study of Compact Thermal Modeling Phenomena", IEEE CPT 24, pp.559-565
4. th THERMINIC Workshop, Madrid, pp.251-259
5. th THERMINIC, Paris, pp.191-196
6. Bosch E., Sabry N., 2001, "Thermal Compact Models for Electronic Systems", Proceedings of SEMI-THERM XVIII, San Jose, CA, USA, pp. 21-29
7. thTHERMINIC, Budapest, pp.217-222
8. Pape, H., Schweitzer D., Janssen J., Morelli A., Villa C., 2003, "Thermal Transient Modeling And Experimental Validation In The European Project PROFIT", Proc. SEMI-THERM XIX, San Jose, March pp. 247-254
9. Lasance C., Sabry N., 2003, "The Use of time-dependent temperature response curves for the generation of (dynamic) compact thermal models", Proc. Interpack, July
10. Farkas G., Poppe A., Kollar E., Stehouwer P., 2003, "Dynamic compact models of cooling mounts for fast board level design", Proc. SEMI-THERM XIX, March 11-13, San Jose, CA, USA, pp.252-262
11. Bosch E. and Lasance C., 2000, "Accurate Measurement of Interface Thermal Resistance by Means of a Transient Method," Proc. 16th SEMITHERM, San Jose CA, pp. 167-173
12. Bosch E. and Lasance C., 2000, "High Accuracy Thermal Interface Measurement of Interface Thermal Resistance", Electronics Cooling, 6, no.3, pp. 26-32
13. Lasance C., Nicole C., van Mil M., 2003, "Test Equipment for the measurement of total hemispherical emissivity and specific heat", Internal PROFIT report D5.2, 2003-04-08
14. Székely V., Ress S., Poppe A., Török S., Magyari D., Benedek Zs., Torki K., Courtois B., Rencz M., 2000, "New approaches in the transient thermal measurements", Microelectronics Journal, Special Issue, pp. 727-734
15. Rencz M., 2003, "New possibilities in the thermal evaluation, offered by transient testing", Microelectronics Journal, 34, No. 3, pp.171-177
16. Szekely V., Rencz M., Török S., Ress S., 2001, "Calculating effective board thermal parameters from transient measurements", IEEE Transactions on Components and Packaging Technologies, 24,No.4, pp. 605-610.
17. Rencz M., Szekely V., 2003, "Non-linearity issues in the dynamic compact model generation", Proc. SEMI-THERM XIX, March 11-13, San Jose, pp. 263-270
18. Rencz M., Poppe A., Szekely V., Courtois B., 2002, "Inclusion of RC compact models of packages into board level thermal simulation tools", Proceedings SEMITHERM XVIII, March 1-14 San Jose, CA, USA, pp. 71-76
19. Warner M, Parry J., Bailey C., Marooney C., Reeves H, Pericleous K., 2001, "FLO/STRESS: An Integrated Stress Solver for the CFD tool FLOTHERM", Proceedings of IPACK 2001, July 8-13, Kauai, Hawaii, USA.
20. Rencz M., Szekely V., Poppe A., Torki K., Courtois B., 2003, "Electro-thermal simulation for the prediction of chip operation within the package", Proc. SEMI-THERM XIX, March 11-13, San Jose, pp. 168-175
21. Lasance C., 2003,"The urgent need for widely accepted test methods for thermal interface materials", Proc. SEMITHERM XIX, March 11-13, San Jose, pp.123-128
22. Benedek Zs., Courtois B., Farkas G., Kollar E., Mir S., Poppe A., Rencz M., Szekely V., Torki K., 2001, "A scalable multi-functional thermal test chip family: Design and evaluation", Transactions of the ASME, Journal of Electronic Packaging, 123, No.4, Dec. pp. 323-330
23. Radivojevic Z., Abdul-Quadir Y., Myllykoski P. and Rantala J., 2003, "Reliability Prediction for TFBGA Assemblies", Proc. SEMI-THERM XIX March 11-13, San Jose, pp.336-340
24. Lasance C., 2003, "Thermally-driven reliability issues in microelectronic systems: Status and Challenges", accepted by Microelectronics Reliability.