Inclusion of RC compact models of packages into board level thermal simulation tools

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 2002, Pages 71-76

  Rencz, M ^a   Szekely V ^b   Poppe, A ^a   Courtois, B ^c  

^a MicReD Ltd   (Hungary)

^b BUDAPEST UNIVERSITY OF TECHNOLOGY AND ECONOMICS   (Hungary)

^c TIMA LABORATORY   (France)

Author keywords

Board level simulation; Co simulation of physical and compact models; Field solvers; RC compact models

Indexed keywords

ALGORITHMS; COMPUTER SIMULATION; HEAT TRANSFER; HEAT TRANSFER COEFFICIENTS; PRINTED CIRCUIT BOARDS; SEMICONDUCTOR JUNCTIONS; TEMPERATURE MEASUREMENT;

THERMAL SIMULATION TOOLS;

CHIP SCALE PACKAGES;

EID: 0036214740     PISSN: 10652221     EISSN: None     Source Type: Journal    
DOI: 10.1109/STHERM.2002.991348     Document Type: Article

References (7)

1. The European project PROFIT: Prediction of temperature gradients influencing the quality of electronic products
2. A generic methodology for deriving compact dynamic thermal models, applied to the PSGA package
3. Creating compact models using standard spreadsheet software
4. THERMAN: A thermal simulation tool for IC chips, microstructures and PW boards
5. A method for generating dynamic thermal multiport models of packages
6. SUNRED: A field solver and compact model generator tool based on successive mode reduction