Non-linearity issues in the dynamic compact model generation

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 2003, Pages 263-270

  Rencz, Marta ^a   Székely, Vladimir ^b  

^a MicReD Ltd   (Hungary)

^b BUDAPEST UNIVERSITY OF TECHNOLOGY AND ECONOMICS   (Hungary)

Author keywords

Compact thermal models; Dynamic compact models; Nonlinear models; Rth and Cth models

Indexed keywords

ALGORITHMS; ALUMINA; BERYLLIA; C (PROGRAMMING LANGUAGE); CERAMIC MATERIALS; COMPUTER SIMULATION; ELECTRONICS PACKAGING; SEMICONDUCTOR MATERIALS; SPECIFIC HEAT; THERMAL CONDUCTIVITY; CHIP SCALE PACKAGES; CIRCUIT SIMULATION; ERROR CORRECTION; PACKAGING MATERIALS; TEMPERATURE DISTRIBUTION; TEMPERATURE SENSORS; THERMAL VARIABLES MEASUREMENT; THERMOGRAPHY (TEMPERATURE MEASUREMENT); TRANSIENT ANALYSIS;

CIRCUIT SIMULATION; DYNAMIC COMPACT THERMAL MODEL; NONLINEAR MODELS;

TEMPERATURE MEASUREMENT; THERMAL CONDUCTIVITY;

CONDUCTING MATERIALS; ELECTRONIC PACKAGING THERMAL MANAGEMENTS; LINEARITY; NONLINEAR CIRCUIT; TEMPERATURE DEPENDENCE;

EID: 0037275635     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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