New possibilities in the thermal evaluation, offered by transient testing

Microelectronics Journal

Volumn 34, Issue 3, 2003, Pages 171-177

  Rencz, Marta ^a  

^a MicReD Ltd   (Hungary)

Author keywords

Die attach qualification; Partial thermal resistance; Structure functions; Thermal modeling; Thermal testing; Thermal transient evaluation; Thermal transient testing

Indexed keywords

HEAT RESISTANCE; MATERIALS TESTING; PRINTED CIRCUIT BOARDS; THERMAL CONDUCTIVITY;

THERMAL TRANSIENT TESTING;

MICROELECTRONICS;

EID: 0037372999     PISSN: 00262692     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2692(02)00185-4     Document Type: Conference Paper

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