Transient creep in free-standing thin polycrystalline aluminum films

Journal of Applied Physics

Volumn 92, Issue 9, 2002, Pages 4968-4975

  Kalkman, A J ^a   Verbruggen, A H ^a   Janssen, G C A M ^b   Radelaar, S ^c  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

^b DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

^c NETHERLANDS INSTITUTE FOR METALS RESEARCH   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

AL FILMS; BULGE TESTS; CREEP STRAIN; CU FILMS; DISLOCATION GLIDE; HIGH RESOLUTION; KEY PARAMETERS; POLYCRYSTALLINE; POLYCRYSTALLINE ALUMINUM; RATE LIMITING; ROOM TEMPERATURE; STRAIN HARDENING COEFFICIENT; STRESS DEPENDENCE; THREE ORDERS OF MAGNITUDE;

COPPER; METALLIC FILMS; PLASTICITY; SILVER; STRAIN HARDENING;

CREEP;

EID: 18744371064     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1509099     Document Type: Article

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