Forced convection board level thermal design methodology for electronic systems

Journal of Electronic Packaging

Volumn 123, Issue 2, 2001, Pages 120-126

  Cole, Reena ^a   Dalton, Tara ^a   Punch, Jeff ^a   Davies, Mark R ^a   Grimes, Ronan ^a  

^a UNIVERSITY OF LIMERICK   (Ireland)

Author keywords

Aerodynamic Influence Factors; Forced Convection Electronic Cooling; Plastic Quad Flat Pack (PQFP); Thermal Design Rules; Thermal Resistance; Upstream Flow Disturbance

Indexed keywords

EID: 0012099703     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1339822     Document Type: Article

References (23)

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