Comparison of numerical predictions and experimental measurements for the transient thermal behavior of a board-mounted electronic component

InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM

Volumn 2002-January, Issue , 2002, Pages 36-45

  Eveloy, V ^a,b   Rodgers, P ^a   Lohan, J ^b  

^a Electronics Thermal Management Ltd   (Ireland)

^b Atlantic Technological University   (Ireland)

Author keywords

Accuracy; Circuit testing; Computational fluid dynamics; Electronic components; Electronic equipment; Heat transfer; Power dissipation; Printed circuits; Temperature measurement; Transient analysis

Indexed keywords

ATMOSPHERIC TEMPERATURE; COMPUTATIONAL FLUID DYNAMICS; ELECTRIC LOSSES; ELECTRIC NETWORK ANALYSIS; ELECTRONIC EQUIPMENT; ELECTRONIC EQUIPMENT TESTING; ENERGY DISSIPATION; FLUID DYNAMICS; HEAT TRANSFER; HEATING EQUIPMENT; OSCILLATORS (ELECTRONIC); PRINTED CIRCUIT TESTING; PRINTED CIRCUITS; TEMPERATURE MEASUREMENT; THERMOANALYSIS; TRANSIENT ANALYSIS;

ACCURACY; AMBIENT AIR TEMPERATURE; CIRCUIT TESTING; COMPONENT JUNCTION TEMPERATURE; COMPUTATIONAL FLUID DYNAMICS CODES; ELECTRONIC COMPONENT; PRINTED CIRCUIT BOARDS (PCB); TRANSIENT OPERATING CONDITION;

PRINTED CIRCUIT BOARDS;

EID: 84950140710     PISSN: 19363958     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2002.1012436     Document Type: Conference Paper

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