Thermal design methodology for electronic systems

InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM

Volumn 2002-January, Issue , 2002, Pages 696-704

  Minichiello, A ^a   Belady, C ^b  

^a Utah Sate University   (United States)

^b HEWLETT PACKARD COMPANY   (United States)

Author keywords

Computational fluid dynamics; Computational modeling; Design methodology; Design optimization; Fluid flow measurement; Heat transfer; Network servers; Numerical models; Performance analysis; Product design

Indexed keywords

COMPUTATIONAL FLUID DYNAMICS; DESIGN; FLOW OF FLUIDS; FLUID DYNAMICS; HEAT TRANSFER; NUMERICAL METHODS; NUMERICAL MODELS;

COMPUTATIONAL MODEL; DESIGN METHODOLOGY; DESIGN OPTIMIZATION; NETWORK SERVER; PERFORMANCE ANALYSIS;

PRODUCT DESIGN;

EID: 84950141534     PISSN: 19363958     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2002.1012523     Document Type: Conference Paper

References (13)

1. C. Belady, "Effective Thermal Design for Electronic Systems", Hewlett-Packard Company, 22 June 2001.
2. C. Biber and C. Belady, "Pressure Drop Prediction for Heat Sinks: What is the Best Method?" Proceedings of InterPACK '97 Conference, ASME, 1997.
3. C. L. Belady et al., "Improving Productivity in Electronic Packaging with Flow Network Modeling (FNM)", Electronics Cooling Magazine, vol. 5, no.1, pp. 36-40, January 1999.
4. G. Ellison, Thermal Computations for Electronic Equipment, New York, New York, Van Nostrand Reinhold Company, Inc. 1984.
5. A. Minichiello, "Flow Network Modeling: A Case Study in Expedient System Prototyping", Proceedings of ITHERM 2000 Conference, vol. 1, pp. 70-77, May 2000.
6. C. D. Patel and C. L. Belady, "Modeling and Metrology in High Performance Heat Sink Design", Proceedings of the 1997 Electronic Components and Technology Conference, San Jose, CA, pp.296-302, May 1997.
7. C. Bash and C. D. Patel, "Modeling and Metrology for Expedient Analysis and Design of Computer Systems", Proceedings of the 1999 ISPS Conference, January 1999.
8. Fluent corporate website: www.fluent.com/software/icepak/.
9. Flomerics corporate website: www.flomerics.com.
10. A. Ortega and R. Moffat, "Experimental Methods in Air Cooling of Electronics", Short Course on Experimental Heat Transfer Methods given at Itherm 2000 Conference,May 2000.
11. Cambridge Accusense corporate website: www.accusense.com.
12. MacroFlow Users Manual, Innovative Research, Inc., 2520 Broadway St. NE, Suite 200, Minneapolis, MN.
13. G.R. Wagner, "Development of a Compact, High Efficiency Cooling Device for the PA8000 Processor," Proceedings of the 1997 ISPS Conference, pp.267-271.