Modeling electronic cooling axial fan flows

Journal of Electronic Packaging

Volumn 123, Issue 2, 2001, Pages 112-119

  Grimes, R ^a   Davies, M ^a   Punch, J ^a   Dalton, T ^a   Cole, R ^a  

^a UNIVERSITY OF LIMERICK   (Ireland)

Author keywords

Axial Flow Cooling Fans; CFD Modeling; Thermal Design

Indexed keywords

EID: 0041702489     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1339821     Document Type: Article

References (8)

1. Hennissen, J., Temmerman, W., Berghmans, J., and Allaert, K., 1997, "Modelling of Axial Fans for Electronic Equipment," Proceedings of EUROTHERM Seminar 45, 20-22 September 1995, Leuven, Belgium, pp. 309-318.
2. Baellmans, M., Temmerman, W., Berghmans, J., Meyers, J., and Voorspools, K., 1997, "Fan Characterization for Electronic Equipment Cooling With Forced Convection," Proceedings of Eurotherm Seminar 58, Sept. Nantes, France.
3. Nakamura, H., and Komura, T., 1996, "Flow Analysis for Electronic Equipment Cooling," NEC Res. Dev., 37, No. 1, Jan, pp. 21-34.
4. BS 848: 1980, Fans for general purposes, Part 1: Methods for testing performance.
5. Cole, R., Dalton, T., Punch, J., Davies, M., and Grimes, R., 2001, "Forced Convection Board Level Thermal Design Methodology," ASME J. Electron. Packag., 123, published in this issue, pp. 120-126.
6. Goldstein, R. J., 1983, Fluid Mechanics Measurements, Hemisphere, pp. 331-341.
7. Bejan, A., 1995, Convection Heat Transfer, 2nd Ed., Wiley, New York, p. 269.
8. Schlichting, H., 1979, Boundary Layer Theory, 7th Ed., McGraw-Hill, London, p. 734.