Thermal design of mobile computers

American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD

Volumn 343, Issue , 1997, Pages 9-15

  Holt, Brendon R ^a   Ghosh, Prosenjit ^a   Wyatt, W Gerald ^a  

^a TEXAS INSTRUMENTS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0345272091     PISSN: 02725673     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

1. Bar-Cohen, A. and Kraus, A. D., 1990, Advances in Thermal Modeling of Electronic Components and Systems, Volume 1
2. Bar-Cohen, A. and Kraus, A. D., 1992, Advances in Thermal Modeling of Electronic Components and Systems, Volume 2
3. Bar-Cohen, A. and Kraus, A. D., 1993, Advances in Thermal Modeling of Electronic Components and Systems, Volume 3
4. Flotherm, 1992, Flotherm Reference Manual, Version 1.3, Doc.# Flotherm/rm/1192 Issue 1.0; Flomerics Limited, p. x
5. Fluent, May 1995, Fluent/Uns User's Guide, Release 3.2; Fluent Incorporated
6. Icepak, 1995, Icepak Reference Manual, version 1.1; Fluid Dynamics International, Inc., p. 1-1
7. Incropera, F., and DeWitt, D., 1985, Fundamentals of Heat and Mass Transfer, John Wiley & Sons, Inc
8. Kraus, A and Bar-Cohen, A. 1983, Thermal Analysis and Control of Electronic Equipment, Hemisphere Publishing Co.
9. Patran,1993, P3/Patran User Manual, Volume 1, Release 1.2; Publication No. 903000; PDA ; Engineering; December, p. 1-1
10. Streeter, V. L., and Wylie E. B., 1979, Fluid Mechanics, McGraw Hill, Seventh edition
11. Rohsenow, W and Choi, H., 1961, Heat, Mass, And Momentum Transfer, Prentice Hall