Model for photoresist trim etch in inductively coupled CF 4/O 2 plasma

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 22, Issue 1, 2004, Pages 202-211

  Rauf, Shahid ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

HYBRID PLASMA EQUIPMENT MODELS (HPEM); TRIM ETCHING;

ANTIREFLECTION COATINGS; COMPUTER SIMULATION; DEPOSITION; DISSOCIATION; EROSION; ETCHING; EXTRACTION; INDUCTIVELY COUPLED PLASMA; IONIZATION; MATHEMATICAL MODELS; POLYMERIZATION; SPUTTERING;

PHOTORESISTS;

EID: 1642346703     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Conference Paper

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