Saddle Add-On Metallization for RF-IC Technology

IEEE Transactions on Electron Devices

Volumn 51, Issue 3, 2004, Pages 460-466

  Burghartz, Joachim N ^a   Rejaei, Behzad ^a   Schellevis, Hugo ^a  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

BiCMOS integrated circuits; CMOS integrated circuits; Conductivity; Conductors; Copper; Electromagnetic induction; Inductors; Integrated circuits; Losses; Magnetic fields; Microwave devices; Passive circuits; Scattering parameters measurements; Silicon

Indexed keywords

COPPER; ELECTRIC CONDUCTIVITY; ELECTRIC CONDUCTORS; ELECTRIC INDUCTORS; ELECTROMAGNETIC FIELD EFFECTS; INTERCONNECTION NETWORKS; MICROWAVE DEVICES; PASSIVE NETWORKS; SEMICONDUCTING SILICON;

BICMOS INTEGRATED CIRCUITS; ELECTROMAGNETIC INDUCTION; OHMIC LOSSES; SCATTERING PARAMETERS MEASUREMENTS;

CMOS INTEGRATED CIRCUITS;

EID: 1642340486     PISSN: 00189383     EISSN: None     Source Type: Journal    
DOI: 10.1109/TED.2004.823325     Document Type: Article

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