Dispersion number studies in CMP of interlayer dielectric films

Journal of the Electrochemical Society

Volumn 150, Issue 12, 2003, Pages

  Philipossian, Ara ^a   Mitchell, Erin ^a  

^a University of Arizona   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL MECHANICAL POLISHING; CHEMICAL REACTORS; COMPUTATIONAL FLUID DYNAMICS; DIFFUSION; FLOW OF FLUIDS; LUBRICATION; MATHEMATICAL MODELS; OPTIMIZATION; PRESSURE EFFECTS; THICKNESS MEASUREMENT; VELOCITY; VISCOSITY OF LIQUIDS;

CHEMICAL MECHANICAL PLANARIZATION; FILM THICKNESS; PAD-WAFER VELOCITY; RESIDENCE TIME DISTRIBUTION; SLURRY FLOW RATE; WAFER PRESSURE;

DIELECTRIC FILMS;

EID: 0347682151     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1627352     Document Type: Article

References (11)

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