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Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 39, Issue 11, 2000, Pages 6216-6222

Slurry chemical corrosion and galvanic corrosion during copper chemical mechanical polishing

(4) Kondo, Seiichi a Sakuma, Noriyuki a Homma, Yoshio a Ohashi, Naofumi a

a HITACHI LTD (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL POLISHING; CORROSION INHIBITORS; METALLIZING; SLURRIES; TANTALUM; TANTALUM COMPOUNDS; TITANIUM; TITANIUM NITRIDE; TUNGSTEN; TUNGSTEN COMPOUNDS; ULSI CIRCUITS; WATER;

BENZOTRIAZOLE; CHEMICAL MECHANICAL POLISHING (CMP); DAMASCENE; GALVANIC CORROSION;

COPPER CORROSION;

EID: 0034315306 PISSN: 00214922 EISSN: None Source Type: Journal
DOI: 10.1143/jjap.39.6216 Document Type: Article

Times cited : (71)

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