Development of no-flow underfill materials for lead-free solder bumped flip-chip applications

IEEE Transactions on Components and Packaging Technologies

Volumn 24, Issue 1, 2001, Pages 59-66

  Zhang, Z Q ^b   Shi, S H ^b   Wong, C P ^a,b  

^a IEEE   (United States)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Epoxy resin; Flip chip; Lead free solder; Microelectronic packaging; No flow underfill material

Indexed keywords

DYNAMIC MECHANICAL ANALYZERS (DMA); THERMOMECHANICAL ANALYZERS (TMA);

CURING; DIFFERENTIAL SCANNING CALORIMETRY; ELECTRONICS PACKAGING; EUTECTICS; FILLERS; RHEOMETERS; SOLDERING ALLOYS; THERMOGRAVIMETRIC ANALYSIS; TIN ALLOYS;

FLIP CHIP DEVICES;

EID: 0035279927     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.910803     Document Type: Article

References (11)

1. Trends in IC packaging
2. Resin-insertion effect on thermal cycle resistivity of flip-chip mounted LSI devices
3. Flip-chip solder bump fatigue life enhanced by polymer encapsulation
4. Underfill encapsulant for flip chip applications
5. High performance underfills development- materials, process, and reliability
6. High performance no-flow underfills for low-cost flip-chip applications: Material characterization
7. Characterization of a no-flow underfill encapsulant during the solder reflow process
8. Study of the fluxing agent effects on the properties of no-flow underfill materials for flip-chip applications
9. High performance no-flow underfills for low-cost flip-chip applications: Material characterization
10. Lead-free soldering-where the world is going