Visco-elastic-plastic properties and constitutive modeling of underfills

Proceedings - Electronic Components and Technology Conference

Volumn Part F133492, Issue , 1998, Pages 969-974

  Qian, Zhengfang ^a   Yang, Jian ^a   Liu, Sheng ^a  

^a Wayne State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELASTIC MODULI; FILLED POLYMERS; MECHANICAL TESTING; NETWORK COMPONENTS; STRAIN RATE; TEMPERATURE DISTRIBUTION; ELASTOPLASTICITY; POLYMERS; SOLDERING ALLOYS; THERMAL EFFECTS; VISCOELASTICITY;

MODEL PREDICTION; SAMPLE PREPARATION; SOLDER ALLOYS; TEMPERATURE DEPENDENCE; TEST PROCEDURES; THERMO-MECHANICAL TESTING; THERMOMECHANICAL PROPERTIES; VISCO ELASTIC PLASTICS; UNDERFILLS;

ELASTOPLASTICITY; ELECTRONICS PACKAGING;

EID: 0031636964     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.1998.678826     Document Type: Conference Paper

References (13)

1. CINDAS data base, 1997, SRC Document, Purdue University.
2. Frost H. J., Ashby M. F., 1982, Deformation Mechanism Maps, Oxford Press, London, 1-12.
3. Harper B. D., Lu L., Kenner V. H., 1997, "Effects of Temperature and Moisture Upon the Mechanical Behavior of an Epoxy Molding Compound", Advances in Electronic Packaging, ASME EEP-Vol. 19-1, 1207-1212.
4. Lau J. H., 1996, Flip Chip Technologies, McGraw-Hall, New York Lu Minfu and Liu Sheng, 1996, "A Multi-Axial Thermo-Mechanical Fatigue Tester for Electronic Packaging Materials" Sensing, Modeling and Simulation in Emerging Electronic Packaging, ASME EEP-V17, 87-92.
5. Merton M. M., Mahajan R. L., Nikmanesh N., 1997, "Alternative Curing Methods for FCOB Underfill", Advances in Electronic Packaging, ASME EEP-Vol. 19-1, 291-300.
6. Product Bulletin of HYSOL FP4526, 1997, Electronic Materials Division, Dexter Corporation, 1-2.
7. Qian Zhengfang, Lu Minfu, Wang Jianjun, Liu Sheng, 1997, "Testing and Constitutive Modeling of Thin Polymer Films and Underfills by a 6-Axis Submicron Tester", Applications of Experimental Mechanics to Electronic Packaging, ASME EEP-Vol. 22/AMD-Vol. 226, 205-112.
8. Qian Zhengfang and Liu Sheng, 1997a, "A Unified Viscoplastic Constitutive Model for Tin-Lead Solder Joints", Advances in Electronic Packaging, ASME EEP-Vol. 19-2, 1599-1604.
9. Qian Zhengfang and Liu Sheng, 1997b, "A Damage Coupling Framework of Unified Viscoplasticity for the Fatigue of Solder Alloys", ASME 97-WA/EEP-8 for publication in ASME J. Elec. Packg.
10. Ren W., Qian Z., Lu. M, Liu S., Shangguan D, 1997, "Thermal Mechanical Property of Two Solder Alloys", Applications of Experimental Mechanics to Electronic Packaging, ASME EEP-Vol. 22/AMD-Vol. 226, 125-130, Accepted for publication in ASME J. Elec. Packg.
11. Schubert A., 1997, "Thermo-Mechanical Reliability Analysis of Flip-Chip Assemblies by Combined Microdac and the Finite Element: Method", Advances in Electronic Packaging, ASME EEP-Vol. 19-2, 1647-1654.
12. Wang Jianjun, Qian Zhengfang, Liu Sheng, 1997, "Processing Mechanics for Flip-Chip Assemblies", Micro Materials'97, Berlin, Germany, April, 16-18.
13. Wong C. P., Shi S. H., Jefferson G., 1997, "High Performance No Flow Underfills for Low-Cost Flip-Chip Applications", Proc. of the 47th Electronic Components & Technology Conference, IEEE CPMT, San Jose, CA, 850-858.