Reliability of underfill-encapsulated flip-chips with heat spreaders

Journal of Electronic Packaging, Transactions of the ASME

Volumn 120, Issue 4, 1998, Pages 322-327

  Doi, H ^a   Kawano, K ^a   Yasukawa, A ^a   Sato, T ^a  

^a HITACHI LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; DELAMINATION; FAILURE ANALYSIS; FATIGUE OF MATERIALS; FLIP CHIP DEVICES; SOLDERED JOINTS; STRESS ANALYSIS; THERMAL CYCLING;

HEAT SPREADERS;

ELECTRONICS PACKAGING;

EID: 0032296322     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792641     Document Type: Article

References (6)

1. Case N-47-12 (1592-12), 1977, (Case of the ASME Boiler and Pressure Vessel Code) The American Society of Mechanical Engineers, New York.
2. Clementi, J., et al., 1993, “Flip-Chip Encapsulation on Ceramic Substrates,” Proceedings of the 43rd Electronic Component and Technology Conference, IEEE, FL, pp. 175-181.
3. Doi, K., et al., 1995, “Prediction of Thermal Fatigue Life for Encapsulated Flip Chip Interconnection,” Proceedings of ISHM, pp. 247-252.
4. Nakano, F., Soga, T., and Amagi, S., 1987, “Resin-Insertion Effect on Thermal Cycling Resistivity of Flip Chip Mounted LSI Devices,” Proceedings of ISHM, pp. 536-541.
5. Satoh, R., et al., 1991, “Thermal Fatigue Life of Pb-Sn Alloy Interconnections,”IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 14, pp. 224-230.
6. Suryanarayana, D., et al., 1991, “Enhancement of Flip-Chip Fatigue Life by Encapsulation,”IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 14, pp. 218-223.