Chemical kinetic model of interfacial degradation of adhesive joints

IEEE Transactions on Components and Packaging Technologies

Volumn 22, Issue 2, 1999, Pages 215-220

  Lam, David C C ^a   Yang, Fan ^a   Tong, Pin ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE JOINTS; CRACK PROPAGATION; DEGRADATION; DELAMINATION; DIFFUSION IN LIQUIDS; FINITE ELEMENT METHOD; HYDRATION; MATHEMATICAL MODELS; REACTION KINETICS; STRENGTH OF MATERIALS; STRESS CONCENTRATION;

INTERFACIAL CRACKS;

ELECTRONICS PACKAGING;

EID: 0033344404     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.774734     Document Type: Article

References (8)

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