Adhesion and reliability of underfill/substrate interfaces in flip chip BGA packages: Metrology and characterization

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 2002, Pages 206-214

  Nagarajan, Kumar ^a   Dauskardt, Reinhold H ^a  

^a AGERE SYSTEMS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; COMPOSITION EFFECTS; CRACK PROPAGATION; DELAMINATION; FLIP CHIP DEVICES; FRACTURE MECHANICS; INTERFACES (MATERIALS); MATHEMATICAL MODELS; RELIABILITY; SUBSTRATES; THERMAL EFFECTS;

FLIP CHIP PACKAGES; HUMIDITY CONTROLLED ENVIRONMENT; INTERFACIAL CHEMISTRY; INTERFACIAL DELAMINATION; STRAIN ENERGY RELEASE RATE; SUBCRITICAL DEBONDING;

ELECTRONICS PACKAGING;

EID: 0036395365     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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