Processing and reliability of fast-flow, snap-cure underfills-part i: processing and moisture sensitivity

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 23, Issue 4, 2000, Pages 259-266

  Baldwin, Daniel F ^a   Houston, Paul N ^a   Deladisma, Marnico ^a   Crane, Lawrence N ^a   Konarski, Mark M ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Flip chip; Moisture sensitivity; Processing; Underfills

Indexed keywords

MOISTURE SENSITIVITY;

CALORIMETRY; ELECTRONICS PACKAGING; INTEGRATED CIRCUIT MANUFACTURE; MOISTURE DETERMINATION; RELIABILITY; SURFACE MOUNT TECHNOLOGY;

FLIP CHIP DEVICES;

EID: 0034290330     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/6104.895070     Document Type: Article

References (4)

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4. B. Cobb, P. Fine, B. Ma, L. Nguyen, A. Savoca, and Q. Tong, "Novel fast cure and reworkable underfill materials," in Proc. 49th Electron. Comp. Technol. Conf., San Diego, CA, 1999.