Influence of temperature and humidity on adhesion of underfills for flip chip packaging

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2001, Pages 155-162

  Luo, S ^a   Wong, C P ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Adhesion; Aging; BCB; Coupling agent; Passivation; PI; SiN; SiO2; Underfill

Indexed keywords

ADHESION; DEGRADATION; FLIP CHIP DEVICES; GLASS TRANSITION; HYDROPHILICITY; MOISTURE; REACTION KINETICS; SILICA; SILICON NITRIDE; TEMPERATURE; THERMAL CYCLING; THERMAL EFFECTS;

ADHESION STABILITY; DEGRADATION KINETICS; FLIP CHIP PACKAGING; HYDROPHILIC PASSIVATION; UNDERFILL;

ELECTRONICS PACKAGING;

EID: 0034829221     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (16)

1. Encapsulants used in flip-chip packages
2. Underfill and encapsulation
3. Effects of adhesion and delamination on stress singularities in plastic-packaged integrated circuits
4. A new approach for thermal fatigue testing of the underfill/passivation interface
5. Materials and mechanics issues in flip-chip organic packaging
6. Polymer interfacial adhesion in microelectronic assemblies
7. Characterization of underfill/passivation interfacial adhesion for direct chip attach assemblies using fracture toughness and hydro-thermal fatigue measurements
8. Enhancement of underfill adhesion to die and substrate by use of silane additives
9. Investigation on effect of coupling agents in epoxy based underfill material for flip-chip applications
10. Chemical kinetic model of interfacial degradation of adhesive joints
11. The mechanics and impact of hygroscopic swelling of polymeric materials in electronic packaging
12. Pre-encapsulation cleaning methods and control for microelectronics packaging
13. Study on mobility of water and polymer chain in epoxy for microelectronic applications
14. Fundamental study on adhesion improvement for underfill using adhesion promoter