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1
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14844316457
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Tutorial: Dispensing: The materials, processes and tools needed to achieve manufacturing success
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Mar
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Tutorial: Dispensing: The Materials, Processes and Tools Needed To Achieve Manufacturing Success, Tom Karlinski and Craig Lazinsky, Chip scale review, Mar 2001
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(2001)
Chip Scale Review
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Karlinski, T.1
Lazinsky, C.2
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2
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14844294239
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Different dispensers for different materials: DCA, flip chip underfill and SMA
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March
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Different Dispensers for Different Materials: DCA, Flip Chip Underfill and SMA, Frank Murch, Surface Mount Technology, March 2002
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(2002)
Surface Mount Technology
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Murch, F.1
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3
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0036149225
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Going mainstreamwith chip-on-board
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Jan
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Going Mainstreamwith Chip-on-Board, Mukul Luthra, Circuits Assembly, Jan 2002, p33-44
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(2002)
Circuits Assembly
, pp. 33-44
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Luthra, M.1
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4
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14844322736
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Die bonding, Kim Cassady, http://chenjian.virtualave.net/packaging/pro/ basic/step2.htm
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Die Bonding
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Cassady, K.1
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5
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14844338050
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CSPs present new challenges for die attach eqipment
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Jan - Feb
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CSPs Present New Challenges for Die Attach Eqipment, Lau Siu Wing and Joseph Poh, Chip scale review, Jan - Feb 2001
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(2001)
Chip Scale Review
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Lau Siu Wing1
Poh, J.2
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6
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8444225344
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Emerging trends drive evolution of underfill dispensing - New technologies provide solid process capabilities for a variety of interconnect strategies
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June
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Emerging trends drive evolution of underfill dispensing - New technologies provide solid process capabilities for a variety of interconnect strategies. S. J. Adamson, W. Walters, D. Gibson and C. Ness, Advanced Packaging, June 2000
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(2000)
Advanced Packaging
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Adamson, S.J.1
Walters, W.2
Gibson, D.3
Ness, C.4
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7
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0034248185
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Underfill design and process considerations
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Aug
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Underfill Design and Process Considerations, S. J. Adamson, Surface Mount Technology, Aug 2000
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(2000)
Surface Mount Technology
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Adamson, S.J.1
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8
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14844324286
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Underfill: What designers applaud and manufacturers tolerate
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Feb
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Underfill: what designers applaud and manufacturers tolerate, Daniel K Ward, Advanced Packaging, Feb 2000
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(2000)
Advanced Packaging
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Ward, D.K.1
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10
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0036607668
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BGA, CSP and flip chip: When to use which process, and why
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June
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BGA, CSP and flip chip: When to use which process, and why, Steven J. Adamson, Advanced Packaging, June 2002
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(2002)
Advanced Packaging
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Adamson, S.J.1
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11
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84882204886
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Technical forum: Beyond flip-chip, underfills enhance CSP reliability
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Mar
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Technical Forum: Beyond Flip-Chip, Underfills Enhance CSP Reliability, Erin Yaeger, George Carson, Chip scale review, Mar 2001
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(2001)
Chip Scale Review
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Yaeger, E.1
Carson, G.2
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14
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0038167497
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Underfill techniques: Automated dispensing and jetting
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June
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Underfill Techniques: Automated Dispensing and Jetting, Alan Lewis, Advanced Packaging June, 2003
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(2003)
Advanced Packaging
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Lewis, A.1
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15
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14844336637
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Fluid jetting for next generation package
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APRIL
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Fluid jetting for next generation package, Horatio Quinones, Alec Babiarz, Christian Deck, Pac Tech, APRIL 2002.
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(2002)
Pac Tech
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Quinones, H.1
Babiarz, A.2
Deck, C.3
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16
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14844307955
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Fluid jetting for next microelectronics
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Stockholm, Sweden September
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Fluid jetting for next microelectronics, H. Quinones, A. Babiarz, L. Fang, IMAPS Nordic, Stockholm, Sweden September 2002
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(2002)
IMAPS Nordic
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Quinones, H.1
Babiarz, A.2
Fang, L.3
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18
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8344263161
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Small-volume dispensing
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Feb
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Small-volume dispensing, Russ Peek, Advanced Packaging, Feb 2001
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(2001)
Advanced Packaging
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Peek, R.1
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19
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14844318439
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Dispensing dots
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April
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Dispensing dots, John Sprovieri, Assembly, April 2002
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(2002)
Assembly
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Sprovieri, J.1
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21
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14844292369
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Precision needle dispensing - Get to the point
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Jan- Feb
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Precision Needle Dispensing - Get to the Point, Jeffrey P. Fugere, Chip scale review, Jan- Feb 2002
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(2002)
Chip Scale Review
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Fugere, J.P.1
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22
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14844291121
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Placing tiny parts precisely
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Jan-Feb
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Placing Tiny Parts Precisely, Patricia Carter-Roberts, Assembly, Jan-Feb 2003
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(2003)
Assembly
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Carter-Roberts, P.1
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26
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14844335327
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Dispensing equipment trends: Accuracy and cost of ownership are the buywords
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Jan-Feb
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Dispensing Equipment Trends: Accuracy and Cost of Ownership Are the Buywords, Ron Iscoff, chip scale review, Jan-Feb, 2002
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(2002)
Chip Scale Review
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Iscoff, R.1
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27
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77949697387
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Fiber optics dispensing sees the future through automation
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Mar
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Fiber optics dispensing sees the future through automation, Mike Fornes, Surface Mount Technology, Mar 2002
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(2002)
Surface Mount Technology
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Fornes, M.1
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30
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14844325277
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BGA underfills increasing board-level solder joint reliability
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Dec
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BGA underfills increasing board-level solder joint reliability, Zane Johnson, Thomas Koschimieder, Advanced Packaging, Dec 2001
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(2001)
Advanced Packaging
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Johnson, Z.1
Koschimieder, T.2
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31
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14844305827
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The back-end process: Step 8 flip chip underfill, A guide for successful processes
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Aug
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The back-end process: Step 8 Flip Chip Underfill, A guide for successful processes, Bruno Miquel, Advanced Packaging, Aug 2002
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(2002)
Advanced Packaging
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Miquel, B.1
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32
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14844305826
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Dispensing for area array devices: The technology is evolving into larger higher I/O die
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Jan-Feb
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Dispensing for area array devices: the technology is evolving into larger higher I/O die, Terrence E Thompson, Advanced Packaging, Jan-Feb 2003
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(2003)
Advanced Packaging
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Thompson, T.E.1
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33
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0035493793
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Application assessment of high throughput flip chip assembly for a high lead-eutectic solder cap interconnect system using no-flow underfill materials
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Application assessment of high throughput flip chip assembly for a high lead-eutectic solder cap interconnect system using no-flow underfill materials, David Milner, Daniel F.Baldwin, IEEE Transactions on Electronics Packaging Manufacturing, v 24(2001), n 4, p 307-312
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(2001)
IEEE Transactions on Electronics Packaging Manufacturing
, vol.24
, Issue.4
, pp. 307-312
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Milner, D.1
Baldwin, D.F.2
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34
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0035301154
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Yield analysis and process modeling of low cost, high throughput flip chip assembly based on no-flow underfill materials
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Yield analysis and process modeling of low cost, high throughput flip chip assembly based on no-flow underfill materials, Ryan Thorpe, Daniel F.Baldwin, IEEE Transactions on Electronics Packaging Manufacturing, v 24(2001), n 2, p 123-135
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(2001)
IEEE Transactions on Electronics Packaging Manufacturing
, vol.24
, Issue.2
, pp. 123-135
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Thorpe, R.1
Baldwin, D.F.2
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35
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0034290337
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Modeling of time-pressure fluid dispensing processes
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Modeling of time-pressure fluid dispensing processes, X. B. Chen, G. Shoenau, W. J. Zhang, IEEE Transactions on Electronics Packaging Manufacturing, v 23(2000), n 4, p300-305
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(2000)
IEEE Transactions on Electronics Packaging Manufacturing
, vol.23
, Issue.4
, pp. 300-305
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Chen, X.B.1
Shoenau, G.2
Zhang, W.J.3
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36
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1242286454
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Off-line control time-pressure dispensing process for electronics packaging
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Off-line control time-pressure dispensing process for electronics packaging, X. B. Chen, W. J. Zhang, G Shoenau, B.Surgenor, IEEE Transactions on Electronics Packaging Manufacturing, v 26 (2003), p 286-293
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(2003)
IEEE Transactions on Electronics Packaging Manufacturing
, vol.26
, pp. 286-293
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Chen, X.B.1
Zhang, W.J.2
Shoenau, G.3
Surgenor, B.4
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37
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1242283077
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On the flow rate dynamics in time-pressure dispensing process
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On the flow rate dynamics in time-pressure dispensing process, X. B. Chen, G. Shoenau, W. J. Zhang, Journal of dynamic system, measurement, and control, V124(2002),DEC,P693-698
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(2002)
Journal of Dynamic System, Measurement, and Control
, vol.124
, Issue.DEC
, pp. 693-698
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Chen, X.B.1
Shoenau, G.2
Zhang, W.J.3
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38
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0025491326
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Knowledge -based control of adhesive dispensing for surface mount device assembly
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Knowledge -based control of adhesive dispensing for surface mount device assembly, Rakesh Chandraker, Andrew A. West, David. J. Williams, IEEE Transactions on Components, Hybrids, and Manufacturing Technology, v 13(1990), n 3, p 516-520
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(1990)
IEEE Transactions on Components, Hybrids, and Manufacturing Technology
, vol.13
, Issue.3
, pp. 516-520
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Chandraker, R.1
West, A.A.2
Williams, D.J.3
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39
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0027052182
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A comparison of control paradigms for adhesive dispensing
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A comparison of control paradigms for adhesive dispensing, Andrew A. West, C. J. Hinde, David. J. Williams, Annals of CIRP, V41 (1992), n1,p45-48
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(1992)
Annals of CIRP
, vol.41
, Issue.1
, pp. 45-48
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West, A.A.1
Hinde, C.J.2
Williams, D.J.3
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41
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0034816176
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A conceptual approach to integrate design and control for the epoxy dispensing process
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A conceptual approach to integrate design and control for the epoxy dispensing process, Li, H.-X.; Tso,S.K; Deng,H. International Journal of Advanced Manufacturing Technology, V17 (2001), n 9, p 677-82
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(2001)
International Journal of Advanced Manufacturing Technology
, vol.17
, Issue.9
, pp. 677-682
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Li, H.-X.1
Tso, S.K.2
Deng, H.3
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42
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0344035526
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The process molding of epoxy dispensing for microchip encapsulation using fuzzy linear regression with fuzzy intervals
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The process molding of epoxy dispensing for microchip encapsulation using fuzzy linear regression with fuzzy intervals, C. K. Ip, C. K. Kwong, H. Bai, Y. C. Tsim, International Journal of Advanced Manufacturing Technology, V2292003), p 417-423
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(2003)
International Journal of Advanced Manufacturing Technology
, vol.229
, pp. 417-423
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Ip, C.K.1
Kwong, C.K.2
Bai, H.3
Tsim, Y.C.4
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43
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0037200421
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Drop formation dynamics of constant low-viscosity, elastic fluids
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Drop formation dynamics of constant low-viscosity, elastic fluids J.J. Cooper-White., J.E. Fagan, V. Tirtaatmadja, D.R. Lester, D.V. Boger. J. Non-Newtonian Fluid Mech. 106 (2002) 29-59
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J. Non-newtonian Fluid Mech.
, vol.106
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Cooper-White, J.J.1
Fagan, J.E.2
Tirtaatmadja, V.3
Lester, D.R.4
Boger, D.V.5
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44
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0004918993
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The modified young's situation for the contact angle of a small sessile drop from an interface displacement model
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The modified young's situation for the contact angle of a small sessile drop from an interface displacement model, Harvey Dobbs, International Journal of Modem Physics B, V13 (1999), No 27, p 3255-3250.
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International Journal of Modem Physics B
, vol.13
, Issue.27
, pp. 3255-13250
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Dobbs, H.1
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45
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0035896819
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Inhibition of the finite-time singularity during droplet fission of polymeric fluid
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Apr.
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Inhibition of the finite-time singularity during droplet fission of polymeric fluid. Y.Amarouchene, D.Bone, J.Menunier, and H.Kellay, Physical review letters,Vol 86,No16, Apr. 2001,pp3558-3561
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Physical Review Letters
, vol.86
, Issue.16
, pp. 3558-3561
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Amarouchene, Y.1
Bone, D.2
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Kellay, H.4
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