Modeling of time-pressure fluid dispensing processes

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 23, Issue 4, 2000, Pages 300-305

  Chen, X B ^a   Schoenau, G ^a   Zhang, W J ^a  

^a UNIVERSITY OF SASKATCHEWAN   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; FLOW CONTROL; NON NEWTONIAN FLOW; PRESSURE EFFECTS; PROCESS ENGINEERING;

FLUID DISPENSING;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 0034290337     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/6104.895075     Document Type: Article

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