Underfill techniques: Automated dispensing and jetting

Advanced Packaging

Volumn 12, Issue 6, 2003, Pages 39-41

  Lewis, Alan ^a  

^a Asymtek Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ENCAPSULATION; FLIP CHIP DEVICES; SEMICONDUCTOR DEVICE MANUFACTURE; SURFACE MOUNT TECHNOLOGY;

UNDERFILLING;

ELECTRONICS PACKAGING;

EID: 0038167497     PISSN: 10650555     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Review

References (0)