The process modelling of epoxy dispensing for microchip encapsulation using fuzzy linear regression with fuzzy intervals

International Journal of Advanced Manufacturing Technology

Volumn 22, Issue 5-6, 2003, Pages 417-423

  Ip, C K W ^a   Kwong, C K ^a   Bai, H ^a   Tsim, Y C ^a  

^a HONG KONG POLYTECHNIC UNIVERSITY   (Hong Kong)

Author keywords

Epoxy dispensing; Fuzzy linear regression; Microchip encapsulation; Process modelling

Indexed keywords

ENCAPSULATION; EPOXY RESINS; FUZZY SETS; MICROPROCESSOR CHIPS; NEURAL NETWORKS; PROBABILITY DISTRIBUTIONS; REGRESSION ANALYSIS;

MICROCHIPS;

SYSTEMS ENGINEERING;

EID: 0344035526     PISSN: 02683768     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00170-002-1517-6     Document Type: Article

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