-
1
-
-
1242327904
-
Die encapsulation and flip chip underfilling processes for area array packaging of advanced integrated circuits
-
Tech. Rep., Asymtek
-
A. J. Babiarz. (1997) Die encapsulation and flip chip underfilling processes for area array packaging of advanced integrated circuits. Tech. Rep., Asymtek. [Online]. Available: http://www.asymtek.com/news/articles.htm
-
(1997)
-
-
Babiarz, A.J.1
-
4
-
-
0031276349
-
Analysis of the flow of encapsulant during underfill encapsulation of flip-chips
-
Nov.
-
S. Han and K. K. Wang, "Analysis of the flow of encapsulant during underfill encapsulation of flip-chips," IEEE Trans. Comp., Packag., Manufact. Technol. B, vol. 20, pp. 424-433, Nov. 1997.
-
(1997)
IEEE Trans. Comp., Packag., Manufact. Technol. B
, vol.20
, pp. 424-433
-
-
Han, S.1
Wang, K.K.2
-
6
-
-
0031191741
-
Matching fluid dispensers to materials for electronics applications
-
R. Bush, "Matching fluid dispensers to materials for electronics applications," Electron. Packag. Prod., vol. 37, pp. 56-62, 1997.
-
(1997)
Electron. Packag. Prod.
, vol.37
, pp. 56-62
-
-
Bush, R.1
-
7
-
-
1242327899
-
Practical issues concerning dispensing pump technologies
-
Aug.
-
D. Dixon et al., "Practical issues concerning dispensing pump technologies," Circuits Assembly, pp. 36-40, Aug. 1997.
-
(1997)
Circuits Assembly
, pp. 36-40
-
-
Dixon, D.1
-
8
-
-
0032108861
-
Designed experiments to investigate the solder joint quality output of a prototype automated surface mount replacement system
-
July
-
I. Fidan et al., "Designed experiments to investigate the solder joint quality output of a prototype automated surface mount replacement system," IEEE Trans. Comp., Packag., Manufact. Technol. C, vol. 21, pp. 172-181, July 1998.
-
(1998)
IEEE Trans. Comp., Packag., Manufact. Technol. C
, vol.21
, pp. 172-181
-
-
Fidan, I.1
-
9
-
-
1242327898
-
Modeling and off-line control of fluid dispensing for electronics packaging
-
Ph.D. dissertation, Univ. of Saskatchewan, Saskatoon, SK, Canada
-
X. B. Chen, "Modeling and off-line control of fluid dispensing for electronics packaging," Ph.D. dissertation, Univ. of Saskatchewan, Saskatoon, SK, Canada, 2002.
-
(2002)
-
-
Chen, X.B.1
-
10
-
-
1242327902
-
Method of compensating for changes in flow characteristics of a dispensed fluid
-
C. A. Bretmersky et al., "Method of compensating for changes in flow characteristics of a dispensed fluid," U.S. Patent 5 995 909, 1999.
-
(1999)
U.S. Patent 5 995 909
-
-
Bretmersky, C.A.1
-
11
-
-
1242327901
-
Viscous material dispensing system and method with feedback control
-
M. A. Reighard et al., "Viscous material dispensing system and method with feedback control," U.S. Patent 6 173 864, 2001.
-
(2001)
U.S. Patent 6 173 864
-
-
Reighard, M.A.1
-
12
-
-
1242305442
-
Flip chip underfill system and method
-
C. E. Bouras et al., "Flip chip underfill system and method," U.S. Patent 5 906 682, 1999.
-
(1999)
U.S. Patent 5 906 682
-
-
Bouras, C.E.1
-
13
-
-
0029375607
-
Control of an automated dispensing cell with vision controlled feedback
-
A. Razban et al., "Control of an automated dispensing cell with vision controlled feedback," Contr. Eng. Practice, vol. 3, pp. 1217-1223, 1995.
-
(1995)
Contr. Eng. Practice
, vol.3
, pp. 1217-1223
-
-
Razban, A.1
-
14
-
-
0029521058
-
Experience of the application of intelligent control paradigms to real manufacturing processes
-
A. A. West, D. J. Williams, and C. J. Hinde, "Experience of the application of intelligent control paradigms to real manufacturing processes," Proc. Instn. Mech. Eng., vol. 209, pp. 293-308, 1995.
-
(1995)
Proc. Instn. Mech. Eng.
, vol.209
, pp. 293-308
-
-
West, A.A.1
Williams, D.J.2
Hinde, C.J.3
-
15
-
-
0027660013
-
Rheological models used for the prediction of the flow properties of food products: A Leterature review
-
S. D. Holdsworth, "Rheological models used for the prediction of the flow properties of food products: A Leterature review," Trans. Instit. Chem. Eng., vol. 71, no. C3, pp. 139-179, 1993.
-
(1993)
Trans. Instit. Chem. Eng.
, vol.71
, Issue.C3
, pp. 139-179
-
-
Holdsworth, S.D.1
-
16
-
-
0034290337
-
Modeling of time-pressure fluid dispensing process
-
Oct.
-
X. B. Chen, G. Schoenau, and W. J. Zhang, "Modeling of time-pressure fluid dispensing process," IEEE Trans. Electron. Packag. Manufact., vol. 23, pp. 300-305, Oct. 2000.
-
(2000)
IEEE Trans. Electron. Packag. Manufact.
, vol.23
, pp. 300-305
-
-
Chen, X.B.1
Schoenau, G.2
Zhang, W.J.3
-
18
-
-
1242283077
-
On the flow rate dynamics in time-pressure dispensing processes
-
X. B. Chen, G. Schoenau, and W. J. Zhang, "On the flow rate dynamics in time-pressure dispensing processes," ASME J. Dyn. Syst., Meas., Contr., vol. 124, no. 4, pp. 693-698, 2002.
-
(2002)
ASME J. Dyn. Syst., Meas., Contr.
, vol.124
, Issue.4
, pp. 693-698
-
-
Chen, X.B.1
Schoenau, G.2
Zhang, W.J.3
|