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Volumn 15, Issue 4, 2001, Pages
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Micro dispensing comes of age
a
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Author keywords
[No Author keywords available]
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Indexed keywords
CHIP SCALE PACKAGES;
COMPUTER AIDED ENGINEERING;
FLIP CHIP DEVICES;
INTEGRATED CIRCUIT MANUFACTURE;
INTEGRATION;
OPTIMIZATION;
PRINTED CIRCUIT BOARDS;
QUALITY CONTROL;
SEMICONDUCTOR DEVICES;
SURFACE MOUNT TECHNOLOGY;
BALL GRID ARRAYS;
DIRECT CHIP ATTACH;
FLEX CIRCUITS;
INTEGRATED ENGINEERING;
MICRO DISPENSING;
PRECISION DISPENSING;
PUMP TECHNOLOGY;
QUAD FLAT PACKS;
SMALL OUTLINE INTEGRATED CIRCUITS;
MICROELECTRONIC PROCESSING;
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EID: 0035314153
PISSN: 15298930
EISSN: None
Source Type: Journal
DOI: None Document Type: Article |
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Times cited : (18)
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References (0)
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