Flip chip package failure mechanisms

Solid State Technology

Volumn 41, Issue 4, 1998, Pages 59-64

  Semmens, Janet E ^a   Adams, Tom ^a  

^a Sonoscan Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC IMAGING; CRYSTAL DEFECTS; ELECTRONICS PACKAGING;

ACOUSTIC MICRO IMAGING;

FLIP CHIP DEVICES;

EID: 0032035701     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (0)