Analysis of atomic force microscope pull-off forces for gold surfaces portraying nanoscale roughness and specific chemical functionality

Journal of Adhesion Science and Technology

Volumn 18, Issue 1, 2004, Pages 1-17

  Tormoen, Garth W ^a   Drelich, Jaroslaw ^a   Beach III, Elvin R ^b  

^a Michigan Technological University   (United States)

^b DOW CHEMICAL COMPANY   (United States)

Author keywords

Adhesion; Atomic force microscopy; Chemical force microscopy; Contact angles; Pull off forces; Surface free energy; Surface tension

Indexed keywords

ATOMIC FORCE MICROSCOPY; CONTACT ANGLE; FORCE MEASUREMENT; FREE ENERGY; GOLD; MONOLAYERS; MORPHOLOGY; SELF ASSEMBLY; SILICON WAFERS; SULFUR COMPOUNDS; SURFACE ROUGHNESS; SURFACE TENSION; ADHESION; ATMOSPHERIC HUMIDITY; CARBON DIOXIDE; CHEMICAL ANALYSIS; GOLD COATINGS; NANOCANTILEVERS; SELF ASSEMBLED MONOLAYERS;

ATOMIC FORCE MICROSCOPE; DERJAGUIN MULLER TOPOROV CONTACT MECHANICS THEORY; PULL OFF FORCE MEASUREMENTS; SURFACE FREE ENERGY; THIOLS;

ADHESION; ATOMIC FORCE MICROSCOPY;

ACID BASE INTERACTION; ADHESION FORCE DISTRIBUTIONS; ADVANCING CONTACT ANGLE; AFM; ATOMIC FORCE; ATOMIC FORCE MICROSCOPE CANTILEVERS; ATOMIC FORCE MICROSCOPES; CANTILEVER TIP; CHEMICAL FORCE MICROSCOPY; CHEMICAL FUNCTIONALITY; CONTACT MECHANICS; GOLD SURFACES; GOLD-COATED; GOLD-COATED SILICON WAFERS; GRANULAR MORPHOLOGY; MULTIPLE CONTACTS; NANO-SCALE ROUGHNESS; PULL-OFF FORCES; RADII OF CURVATURE; RELATIVE HUMIDITIES; SAMS; SILICON WAFER SUBSTRATES; SURFACE FREE ENERGY; THERMODYNAMIC PARAMETER; WORK OF ADHESION;

EID: 1342287087     PISSN: 01694243     EISSN: None     Source Type: Journal    
DOI: 10.1163/156856104322746965     Document Type: Article

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