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Volumn 11, Issue 2, 2001, Pages 133-139

Patterning, electroplating and removal of SU-8 moulds by excimer laser micromachining

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; ELECTROPLATING; ETCHING; EXCIMER LASERS; LASER ABLATION; LITHOGRAPHY; MICROMACHINING; MOLDS; OPTICAL MICROSCOPY; PROFILOMETRY; SCANNING ELECTRON MICROSCOPY; THERMAL EFFECTS;

EID: 0035278580     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/11/2/308     Document Type: Article
Times cited : (80)

References (22)
  • 4
    • 0005347079 scopus 로고    scopus 로고
    • 1989 US Patent Specification No 4882245, and others
    • Shaw, J.M.1
  • 16
    • 0003559812 scopus 로고
    • Photochemical Processing of Electronic Materials
    • ed I W Boyd and R B Jackman (New York: Academic)
    • (1992) , pp. 377
    • Dyer, P.E.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.