Interfacial delamination and fatigue life estimation of 3D solder bumps in flip-chip packages

Microelectronics Reliability

Volumn 44, Issue 3, 2004, Pages 471-483

  Gu, Yu ^a   Nakamura, Toshio ^a  

^a Stony Brook University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; CRACK PROPAGATION; DELAMINATION; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; FRACTURE TOUGHNESS; MATHEMATICAL MODELS; PASSIVATION; PLASTIC DEFORMATION; STRESS CONCENTRATION;

SOLDER BUMPS; THERMAL FATIGUE; UNDER BUMP METALLURGY (UBM);

FLIP CHIP DEVICES;

EID: 1142263928     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2003.11.002     Document Type: Article

References (27)

1. Lau J.H. Flip chip technologies. 1996;McGraw-Hill, New York.
2. Lau J.H. Low cost flip chip technologies: for DCA, WLCSP, and PBGA assemblies. 2000;McGraw-Hill, New York.
3. Reichl H., Schubert A., Topper M. Reliability of flip chip and chip size packages. Microelectron. Reliab. 40:2000;1243-1254.
4. Wang J., Zou D., Lu M., Ren W., Liu S. Evaluation of interfacial fracture toughness of a flip-chip package and a bimaterial system by a combined experimental and numerical method. Eng. Fract. Mech. 64:1999;781-797.
5. Lau J.H., Lee S.R. Fracture mechanics analysis of low cost solder bumped flip chip assemblies with imperfect underfills. ASME J. Electron. Packaging. 122:2000;306-310.
6. Gu Y., Nakamura T., Chen W., Cotterell B. Interfacial delamination near solder bumps and UBM in flip-chip packages. J. Electron. Packaging. 123:2001;295-301.
7. Kay N, Madenci E, Shkarayev S. Global/local finite element analysis for singular stress fields near the junction of dissimilar elastic and elastic-plastic materials in electronic packages. In: Proceedings - Electronic Components & Technology Conference, 1999. p. 987-93.
8. Madenci E., Shkarayev S., Sergeev B. Thermo-mechanical stresses for a triple junction of dissimilar materials: global-local finite element analysis. J. Theoret. Appl. Fract. Mech. 30:1998;103-117.
9. Madenci E., Shkarayev S., Mahajan R. Potential failure sites in a flip-chip package with and without underfill. J. Electron. Packaging. 120:1998;336-341.
10. Wong TE, Reed BA, Cohen HM, Chu DW. Development of BGA solder joint vibration fatigue life prediction model. In: IEEE Electronic Components and Technology Conference, 1999. p. 149-54.
11. Lu H., Hung K.C., Stoyanov S., Bailey C., Chan Y.C. No-flow underfill flip chip assembly - an experimental and modeling analysis. Microelectron. Reliab. 42:2002;1205-1212.
12. Lu H., Bailey C., Cross M. Reliability analysis of flip chip design via computer simulation. J. Electron. Mater. 122:2000;214-219.
13. Tsukada Y., Nishimura H., Sakame M., Honami M. Fatigue life analysis of solder joints in flip chip bonding. ASME J. Electron. Mater. 122:2000;207-213.
14. Lau J.H., Pao Y. Solder joint reliability of BGA, CSP, flip-chip and fine pitch SMT assemblies. 1997;McGraw-Hill, New York.
15. Engelmaier W. Fatigue life of leadless chip carrier solder joints during power cycling. IEEE Trans. Compon. Hybrids Manufact. Technol. 6:1983;232-237.
16. Gektin V., Bar-Cohen A., Ames J. Coffin-Mason fatigue model of underfilled flip-chips. IEEE Trans. Compon. Packaging Manufact. Technol. Part A. 20(3):1997;317-325.
17. Lenkkeri J., Jaakola T. Rapid power cycling of flip-chip and CSP components on ceramic substrates. Microelectron. Reliab. 41:2000;661-668.
18. Hong B.Z. Finite element modeling of thermal fatigue and damage of solder joints in a ceramic ball grid array package. J. Electron. Mater. 26:1997;814-820.
19. Pecht M.G., Agarwal R., McCluskey P., Dishongh T., Javadpour S., Mahajan R. Electronic packaging materials and their properties. 1999;CRC Press LLC, Florida.
20. Information Sciences Institute. MEMS Material Properties Database. http://mems.isi.edu/mems/materials/ : MEMS Clearinghouse at University of Southern California, 1999.
21. Shih C.F., Moran B., Nakamura T. Energy release rate along a three-dimensional crack front in a thermally stressed body. Int. J. Fract. 30:1986;79-102.
22. Nakamura T., Kamath S.M. Three-dimensional effects in thin film fracture mechanics. Mech. Mater. 13:1992;67-77.
23. Cao H., Evans A. An experimental study of the fracture resistance of bimaterial interfaces. Mech. Mater. 7:1989;295-304.
24. Lo C., Nakamura T., Kushner A. Computational analysis of dynamic crack propagation along a bimaterial interface. Int. J. Solids Struct. 31:1993;145-168.
25. Suresh S. Fatigue of materials. 1998;Cambridge University Press, Cambridge.
26. Paydar N., Tong Y., Akay H.U. A finite element study of factors affecting fatigue life of solder joints. J. Electron. Packaging. 116:1994;265-273.
27. Basaran C., Tang H. Implementation of a thermodynamic framework for damage mechanics of solder interconnects in microelectronics packaging. Int. J. Damage Mech. 11:2002;87-108.