Reliability analysis of flip chip designs via computer simulation

Journal of Electronic Packaging, Transactions of the ASME

Volumn 122, Issue 3, 2000, Pages 214-219

  Lu, Hua ^a   Bailey, C ^a   Cross, M ^a  

^a UNIVERSITY OF GREENWICH   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0000112719     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.1286122     Document Type: Article

References (6)

1. Frear, D. R., 1991, “Thermalmechanical Fatigue in Solder Materials,” Solder Mechanics, A State of Art Assessment, TMS, pp. 191-237.
2. Darveaux, R., and Banerji, K., 1995, “Reliability of PBGA Assembly,” Ball Grid Array Technology, McGraw-Hill, New York, NY, pp. 379-442.
3. Dieter, G. E., 1988, Mechanical Metallurgy, McGraw-Hill, NY.
4. Dudek, R., Nylen, M., Schubert, A., Michel, B., and Reichl H., 1997, “An Efficient Approach to Predict Solder Fatigue Life and its Application to SM-and Area Array Components,” Proceedings of the 1997 Electronic Components and Technology Conference, pp. 462-471.
5. Frear, D., Morgan, H., Burchett, S., and Lau, J. H., eds., 1994, The Mechanics of Solder Alloy, Chapman and Hall.
6. Popelar, S. F., 1997, “A Parametric Study of Flip Chip Reliability Based on Solder Fatigue Modelling,” Twenty First International Electronics Manufacturing Technology Symposium, pp. 299-307.